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Amplitude-calibrated packaged sandwich antenna with embedded plated though holes

A metallized via hole and amplitude calibration technology, which is applied to waveguide horns, circuits, etc., can solve problems such as low gain, incompatibility, and affecting antenna radiation performance, achieve uniform amplitude distribution, and improve aperture efficiency and gain.

Inactive Publication Date: 2015-01-28
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the horn antenna is usually non-planar, incompatible with the planar circuit process, and has a large geometric size, which limits its application in the packaging structure
In recent years, the substrate-integrated waveguide horn antenna developed based on substrate-integrated waveguide technology has the characteristics of small size, light weight, and easy planar integration. However, the gain of the traditional substrate-integrated waveguide horn antenna is relatively low. One of the reasons is that the aperture The amplitude of the electromagnetic field on the surface is very uneven, the middle is large and the two sides are small, which affects the radiation performance of the antenna
At present, methods such as dielectric loading and dielectric prisms have been used to correct the asynchronous phase of the horn's aperture surface, but these methods cannot improve the uniformity of the electromagnetic field amplitude distribution on the aperture surface, and these phase alignment structures increase the overall structural size of the antenna. Not suitable for integration into package internal mezzanine

Method used

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  • Amplitude-calibrated packaged sandwich antenna with embedded plated though holes
  • Amplitude-calibrated packaged sandwich antenna with embedded plated though holes
  • Amplitude-calibrated packaged sandwich antenna with embedded plated though holes

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Embodiment Construction

[0021] The present invention will be further described below in conjunction with drawings and embodiments.

[0022]The implementation scheme adopted in the present invention is: the encapsulated interlayer antenna with embedded metallized via hole amplitude calibration is composed of three parts: microstrip feeder 1, substrate integrated waveguide horn antenna 2 and embedded metallized via hole 3, and these three parts are Integrated on the same dielectric substrate 4, the dielectric substrate is located in the inner layer of the 4-dimensional multilayer package 5; one end of the microstrip feeder 1 is connected to the substrate-integrated waveguide horn antenna 2, and the other end of the microstrip feeder 1 is close to the side of the package, which is the antenna The input and output port 6 of the antenna, the input and output port 6 of the antenna is connected to the coplanar waveguide 7 on the side of the package through a 90-degree transition between the microstrip and th...

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Abstract

The invention relates to a horn antenna, in particular to an amplitude-calibrated packaged sandwich antenna with embedded plated though holes. The antenna comprises a microstrip feeder (1), a horn antenna (2) and plated through holes (3), wherein the microstrip feeder (1), the horn antenna (2) and the plated through holes (3) are integrated on a dielectric substrate (4). The dielectric substrate (4) is inside three-dimensional package (5). One end of the microstrip feeder (1) is connected with an internal circuit (8) through a coplanar waveguide (7) on the side of the package. The horn antenna (2) comprises a bottom metal plane (9), a top metal plane (10) and plated through hole sidewalls (11). The plated through holes (3) form a middle plated through hole array (16), a left plated through hole array (17) and a right plated through hole array (18). Four dielectric loaded waveguides are formed in the horn antenna (2). One end of each dielectric loaded waveguide faces to the microstrip feeder (1), and the other end of each dielectric loaded waveguide is close to an antenna aperture plane (12). Aperture efficiency of the amplitude-calibrated packaged sandwich antenna with embedded plated though holes can be improved.

Description

technical field [0001] The invention relates to a horn antenna, in particular to a package sandwich antenna embedded with metallized via holes for amplitude calibration. Background technique [0002] Using stacked three-dimensional multi-chip (3D-MCM) technology, a radio frequency system can be integrated in a three-dimensional stacked package, for which it is also necessary to integrate the antenna on the package. Usually, the antenna is integrated on the surface of the package, for example, the patch antenna is integrated on the top of the package. But sometimes it is necessary to integrate the antenna in an interlayer in the middle of the package to meet the needs of the system. The above requirements can be achieved if the horn antenna is integrated in the interlayer inside the package. However, horn antennas are usually non-planar, incompatible with planar circuit technology, and have large geometric dimensions, which limits their application in packaging structures. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q13/02
Inventor 赵洪新殷晓星王磊
Owner SOUTHEAST UNIV
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