Amplitude-calibrated packaged sandwich antenna with embedded plated though holes
A metallized via hole and amplitude calibration technology, which is applied to waveguide horns, circuits, etc., can solve problems such as low gain, incompatibility, and affecting antenna radiation performance, achieve uniform amplitude distribution, and improve aperture efficiency and gain.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0021] The present invention will be further described below in conjunction with drawings and embodiments.
[0022]The implementation scheme adopted in the present invention is: the encapsulated interlayer antenna with embedded metallized via hole amplitude calibration is composed of three parts: microstrip feeder 1, substrate integrated waveguide horn antenna 2 and embedded metallized via hole 3, and these three parts are Integrated on the same dielectric substrate 4, the dielectric substrate is located in the inner layer of the 4-dimensional multilayer package 5; one end of the microstrip feeder 1 is connected to the substrate-integrated waveguide horn antenna 2, and the other end of the microstrip feeder 1 is close to the side of the package, which is the antenna The input and output port 6 of the antenna, the input and output port 6 of the antenna is connected to the coplanar waveguide 7 on the side of the package through a 90-degree transition between the microstrip and th...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com