Three-dimensional packaged surface antenna capable of seam phase calibration

Abstract

The invention discloses a three-dimensional packaged surface antenna capable of seam phase calibration and relates to a horn antenna. The antenna comprises a metallized vertical via hole feeder line (1), a horn antenna (2) and seams (3), which are integrated on a medium substrate (4), the medium substrate (4) is arranged on the uppermost surface of a three-dimensional package (5), one end of the metallized vertical vial hole feeder line (1) is connected with an internal circuit (8), the horn antenna (2) is composed of a bottom metal plane (6), a top metal plane (9) and a metallized via hole side wall (11), a plurality of seams (3) are arranged in the bottom metal plane (6) and the top metal plane (9), and several sub-horns (16) are formed in the substrate integrated waveguide horn antenna (2) by the seams (3), one ends of the seams (3) face the short-circuit side (15), and the other ends of the seams (3) are arranged on an antenna aperture surface (12). Electromagnetic wave energy in the antenna can reach the antenna aperture surface (12) by the same phase. By the antenna, antenna aperture efficiency and gains can be improved.

Description

technical field [0001] The invention relates to a horn antenna, in particular to a three-dimensional packaging surface antenna with slot phase calibration. Background technique [0002] Using micro-assembly technology, a radio frequency system can be integrated into a package, for which the antenna also needs to be integrated on the surface of the package. It is a natural way to integrate a patch antenna on the surface of the package, but the main radiation direction of the patch antenna is the normal direction of the surface, and the main radiation direction we sometimes need is along the surface direction. If the horn antenna is integrated on the surface of the package, the radiation along the surface direction can be realized. However, horn antennas are usually non-planar, incompatible with planar circuit technology, and have large geometric dimensions, which limits their application in packaging structures. In recent years, the substrate-integrated waveguide horn anten...

AI Technical Summary

Problems solved by technology

However, the horn antenna is usually non-planar, incompatible with the planar circuit process, and has a large geometric size, which limits its application in the packaging structure

In recent years, the substrate-integrated waveguide horn antenna developed based on substrate-integrated waveguide technology has the characteristics of small size, light weight, and easy planar integration, but the gain of the traditional substrate-integrated waveguide horn antenna is relatively low. The reason is that the horn The continuous opening of the mouth causes the phase out of synchronization when the electromagnetic wave propagates to the horn's aperture surface, the phase distribution of the electric field intensity of the aperture is uneven, and the radiation directivity and gain decrease

At present, methods such as dielectric loading and dielectric prism have been used to correct the asynchronous phase of the horn's aperture surface, but these phase alignment structures are all outside the aperture of the horn antenna, which increases the overall structural size of the antenna and is not suitable for integration into the package surface.

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