Amplitude-calibrated packaging interlayer antenna

Abstract

The invention discloses an amplitude-calibrated packaging interlayer antenna. The amplitude-calibrated packaging interlayer antenna comprises a microstrip feeder (1), a horn antenna (2) and metalized via holes (3) which are integrated on one dielectric substrate (4), the dielectric substrate (4) is arranged on the inner layer of a three-dimensional packaging (5), one end of the microstrip feeder (1) is connected with an internal circuit via a coplanar waveguide (7) on one side of the packaging, the horn antenna (2) is formed by a bottom metal plane (9), a top metal plane (10) and a metalized via hole sidewall (11), three metalized via hole arrays are formed by the metalized via holes (3), a first dielectric fill waveguide (22), a second dielectric fill waveguide (23), a third dielectric fill waveguide (24) and a fourth dielectric fill waveguide (25) are formed in the horn antenna (2), and electromagnetic wave in the antenna can be distributed on an antenna aperture surface (12) in uniform amplitudes. By the aid of the amplitude-calibrated packaging interlayer antenna, aperture efficiency of the antenna can be improved.

Description

technical field [0001] The invention relates to a horn antenna, in particular to a package sandwich antenna with amplitude calibration. Background technique [0002] Using stacked three-dimensional multi-chip (3D-MCM) technology, a radio frequency system can be integrated in a three-dimensional stacked package, usually by integrating the antenna on the surface of the package, for example, integrating the patch antenna on the top of the package. But sometimes it is necessary to integrate the antenna in an interlayer in the middle of the package to meet the needs of the system. The above requirements can be achieved if the horn antenna is integrated in the interlayer inside the package. However, horn antennas are usually non-planar, incompatible with planar circuit technology, and have large geometric dimensions, which limits their application in packaging structures. In recent years, the substrate-integrated waveguide horn antenna developed based on substrate-integrated wav...

AI Technical Summary

Problems solved by technology

However, the horn antenna is usually non-planar, incompatible with the planar circuit process, and has a large geometric size, which limits its application in the packaging structure

In recent years, the substrate-integrated waveguide horn antenna developed based on substrate-integrated waveguide technology has the characteristics of small size, light weight, and easy planar integration. However, the gain of the traditional substrate-integrated waveguide horn antenna is relatively low. One of the reasons is that the aperture The amplitude of the electromagnetic field on the surface is very uneven, the middle is large and the two sides are small, which affects the radiation performance of the antenna

At present, methods such as dielectric loading and dielectric prisms have been used to correct the asynchronous phase of the horn's aperture surface, but these methods cannot improve the uniformity of the electromagnetic field amplitude distribution on the aperture surface, and these phase alignment structures increase the overall structural size of the antenna. Not suitable for integration into package internal mezzanine

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