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Semiconductor package member and fabrication method thereof

A semiconductor and packaging technology, applied in the field of semiconductor packaging and its manufacturing method, can solve problems such as noise generation, affecting the overall height of cooling fans, and inability to meet the thinning requirements of electronic products

Active Publication Date: 2013-03-06
AMTEK SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, the formation of the outwardly extending portion 71a of the above-mentioned printed circuit board 71' will disturb the airflow driven by the fan wheel 73' when it rotates. If the airflow is disturbed, noise will be generated, which will further affect the installation of such a heat dissipation device. The use quality of the electronic products of the fan
At the same time, because the extension part 71a is extended outward, a predetermined distance needs to be maintained between the blade 732' and the control chip 710', which is not conducive to the reduction of the overall height of the existing cooling fan, and cannot meet the requirements of thin electronic products. needs
[0009] Moreover, the existing heat dissipation fan disclosed above still needs to arrange the printed circuit board 71' between the hub 730' of the fan wheel 73' and the base 720' of the housing 72', resulting in the thickness of the printed circuit board 71' still affecting The overall height of the cooling fan can not be further thinned

Method used

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  • Semiconductor package member and fabrication method thereof
  • Semiconductor package member and fabrication method thereof
  • Semiconductor package member and fabrication method thereof

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Experimental program
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no. 1 Embodiment

[0052] see Figure 1A to Figure 1E ', which is a cross-sectional view of the manufacturing method of the semiconductor package of the present invention.

[0053] Such as Figure 1A As shown, first, a substrate 10 having a first surface 10 a and a second surface 10 b is prepared, and a plurality of packaging units P are planned on the substrate 10 . In this embodiment, the substrate 10 has a first positioning hole 101 penetrating through the first surface 10a and the second surface 10b, wherein the first positioning hole 101 can be formed in the center of the packaging unit P of the substrate, or The first positioning hole 101 can be formed eccentrically in the packaging unit P of the substrate 10 , and more space can be left on the first surface 10 a for disposing electronic components, especially functional chips.

[0054] Such as Figure 1B As shown, the shaft sleeve 14 is inserted in the first positioning hole 101; and the stator group 12 and at least one electronic comp...

no. 2 Embodiment

[0060] see Figure 2A to Figure 2C , which is a cross-sectional view of the manufacturing method of the semiconductor package according to the second embodiment of the present invention. In this embodiment, the manufacturing method is substantially the same as that of the first embodiment, the difference is that the substrate 10' is not preset with positioning holes, but is fabricated after forming the encapsulant. The other steps of forming the semiconductor package are the same as those in the first embodiment, so they will not be repeated here.

[0061] Such as Figure 2A As shown, a stator group 12 and at least one electronic component 13 are provided on the first surface 10a' and electrically connected to the first surface 10a', and the substrate 10' formed with the encapsulant 15 is provided.

[0062] Such as Figure 2B As shown, the second positioning hole 201 passing through the substrate 10' and the encapsulant 15 is formed by drilling technology such as laser. an...

no. 3 Embodiment

[0064] This embodiment also provides a method for making a semiconductor package that increases heat dissipation performance, such as Figure 3A The top view shown, can be continued Figure 1C or Figure 2A After forming the encapsulant 15, the ventilation holes 300 penetrating the encapsulant 15 and the substrates 10, 10' are formed by, for example, laser cutting.

[0065] Such as Figure 3B As shown, when the semiconductor package is in operation, the airflow S can enter from the bottom to increase the heat dissipation performance.

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Abstract

The present invention relates to a semiconductor package member and a fabrication method thereof, wherein the semiconductor package is provided for carrying a sleeve member and a fan wheel axially coupled to the sleeve member so as to provide a heat dissipating function. The semiconductor package member includes: a substrate; a stator module and at least an electronic component disposed on the substrate; and an encapsulant formed on the substrate for encapsulating the coil module and the electronic component so as to prevent the coil module and the electronic component from disturbing air flow generated by the fan wheel during operation, thereby avoiding generation of noises or vibrations.

Description

technical field [0001] The invention relates to a semiconductor package and its manufacturing method, especially to a semiconductor package for loading a shaft sleeve and a fan wheel and its manufacturing method. Background technique [0002] For example, the circuit board of the main board (Main Board or Mother Board) is equipped with a large number of electronic components (Electronic Components) such as a central processing unit or a graphics card, and the electrical circuits (Conductive Circuits) used to electrically connect the electronic components, These electronic components will generate heat when they function. If the generated heat is not removed from the electronic product equipped with the circuit board, the electronic components will fail due to overheating; this kind of problem is increasing in function requirements and processing speed Faster electronic products are more important, because the increase in function and processing speed means that more or highe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/467H01L23/427
CPCH05K1/0201H01L2924/15311H01L23/467H01L23/49816H01L23/13H01L2224/16225H01L23/3128H01L21/561H01L2224/48227
Inventor 曾祥伟
Owner AMTEK SEMICON
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