Thyristor module

Abstract

The invention discloses a thyristor module, belonging to the field of manufacturing of power semiconductor modules. The thyristor module adopts a new way to connect a chip and a signal end, therefore, the process and the material are simplified, and the product has connecting structure which is high in reliability and consistency, thereby remarkably optimizing the performance of the product. The thyristor module comprises a bottom plate, a housing, a substrate, a chip I, a chip II, an electrode I, an electrode II, an electrode III, a signal terminal Ga, a signal terminal Ka, a signal terminal Kb and a signal terminal Gb; the front surfaces of the two chips are provided with positive electrodes A, and the back surfaces are provided with negative electrodes K and gates G; and a conductive block zone I, a conductive block zone II, a conductive block zone III, a conductive wire zone I, a conductive wire zone II, a conductive wire zone III and a conductive wire zone IV which are mutually insulated are printed on the top surface of the substrate. According to the thyristor module, the consistency of the product is greatly improved, and the reliability is enhanced as well. Therefore, the raw materials and the process steps of the product are greatly simplified, the manufacturing yield is improved, the performance and the consistency are remarkably enhanced, and the reliability is improved.

Description

technical field [0001] The invention relates to a thyristor power module and its internal connection mode of signal terminals, belonging to the field of power semiconductor module manufacturing. Background technique [0002] The thyristor power module is a collection of several thyristor chips packaged together according to certain topological functions. Generally, in a power module, the bottom surfaces of these thyristor chips are soldered to the metal surface of the insulating substrate. The insulating substrate enables the bottom of the chip to be electrically connected, and also has good heat dissipation performance and electrical insulation relative to the heat dissipation bottom plate. The upper surface of the chip is metallized (usually silver material), and the electrical connection can be realized by soldering molybdenum sheets and metal connection bridges. These power components are fully covered with silicone in the module so that the components are adequately i...

AI Technical Summary

Problems solved by technology

[0005] The main disadvantages of this current connection mode are: the high temperature line 9 and the copper foil area 51 of the DBC board (such as Figure 10 Shown) welding is point-to-surface welding, the process is difficult

Difficult to implement, many failures

In addition, the high-temperature wire 9 suspended in the air without fixing is easy to be pressed by the casing in subsequent operations, causing new failures

Images