High-density nano electrode array and preparation method thereof

Abstract

The invention discloses a preparation method of a high-density nano electrode array. The preparation method comprises the following steps: uniformly and closely distributing nano metal particles on a metal or semiconductor substrate with good conductivity in a one-layer manner, enabling the nano metal particles and the substrate to be closely combined by a high-temperature annealing process, then etching the substrate by utilizing a plasma treatment process, and preparing the nano electrode array structure realizing high density and high depth-width ratio. The invention has the advantages that the nano-scale electrode array structure can be realized by utilizing the conventional microprocessing equipment with no need of special and expensive nano processing equipment, so that the cost is reduced; the process compatibility is good and large-area wafer-level processing can be realized; and an RIE (reactive ion etching) process and a DRIE (deep reactive ion etching) process are production processes with mature and reliable industry, and the etching depth of the substrate can be controlled by parameter control, i.e., the height of the nano array can be controlled. The preparation method can be applicable to the preparation of the nano electrode array under different needs.

Description

technical field [0001] The invention relates to the technical field of micromachining, in particular to a high-density nanometer electrode array and a preparation method thereof. Background technique [0002] Ultra-small electrodes, especially nano-electrodes, have a series of unique and excellent characteristics due to their characteristic scales at the micron, deep submicron and nanometer levels, such as high mass transfer rate, small time constant, low IR loss, long diameter The ratio is significantly improved and the electric field enhancement effect is excellent. Therefore, it has important application value in micro-total analysis system, trace substance detection, single cell and DNA detection and analysis, field emission and other photoelectric conversion devices, and related frontier fields. [0003] Since the 1970s, research on ultra-small electrodes has gradually developed, but with the rapid development of micro-nano electromechanical systems (MEMS / NEMS), especi...

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Problems solved by technology

However, the above method has low yield, poor process compatibility, or the feature size is limited by the lithography line width, or the uniformity is poorly controllable, which limits its large-area industrialization promotion and application.

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