Wire connecting machine

A technology of connecting machine and manipulator, applied in nonlinear optics, optics, instruments, etc., can solve the problems of large equipment footprint, waste of human resources, low degree of automation, etc., achieve regular layout, reduce equipment footprint, The effect of reducing labor costs

Active Publication Date: 2013-01-30
SHENZHEN LIANDE AUTOMATION EQUIP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the existing traditional technology, the FOG production process usually includes pre-pressing and local pressing through the pre-pressing machine and the main pressing machine respectively, and the workpiece to be processed is transported by manual transfer between the mechanism and the mechanism, which is labor-intensive and automatic. The degree is low, and the operator needs to touch the glass, and the equipment occupies a large area in the regular layout, which wastes human resources

Method used

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Embodiment Construction

[0020] Such as figure 1 and figure 2 As shown, the connection machine of the present embodiment includes:

[0021] A mechanical positioning mechanism 1, which is used to position the glass to be pasted and added, including a positioning platform 11;

[0022] An ACF mechanism 2 for attaching ACF on glass, including an ACF platform 21;

[0023] A pre-pressing mechanism 3, which pre-presses the FPC and the ACF-attached glass, including a pre-pressing platform 31;

[0024] A pressure mechanism 4, which performs pressure on the pre-pressed FPC and glass, including a pressure platform 41;

[0025] A feeding platform 5 is used to place the products after the pressing;

[0026] The positioning platform 11, the ACF platform 21, the pre-pressing platform 31, the pressing platform 41 and the blanking platform 5 are successively located on an X-axis, and a first manipulator 61 is arranged between the positioning platform 11 and the ACF platform 21. 1. A second manipulator 62 is prov...

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PUM

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Abstract

The invention discloses a wire connecting machine and relates to liquid crystal display screen processing equipment, in particular to processing equipment for binding a flexible circuit board on a display screen. The wire connecting machine comprises a positioning platform, an ACF (anisotropic conductive film) platform, an ACF detecting platform, pre-pressing platforms, pressing platforms and a discharging platform, wherein the positioning platform, the ACF platform, the ACF detecting platform, the pre-pressing platforms, the pressing platforms and the discharging platform are positioned on the same X axis. A first manipulator is arranged at a relative position between a mechanical positioning mechanism and an ACF mechanism, a second manipulator is arranged at relative positions among the ACF mechanism and the pre-pressing platforms, a third manipulator is arranged at relative positions among the pre-pressing platforms and the pressing platforms, and a four manipulator is arranged at relative positions among the pressing platforms and the discharging platform. Since to-be-processed products are moved on the platforms of each processing mechanism by the aid of the manipulators serving as moving devices, labor power is saved, labor cost for production is lowered, the devices are orderly and more compact in layout, occupied space of the devices is reduced, and operation is more accurate.

Description

technical field [0001] The invention relates to a liquid crystal screen processing device, in particular to a processing device for binding a flexible circuit board to a display screen. technical background [0002] "FOG" refers to bonding FPC to LCD or TP. "FOG" is the abbreviation of English Film (FPC) on Glass. "FPC" is the abbreviation of Flexible Printed Circuit, also known as flexible circuit board, flexible printed circuit board, flexible circuit board, referred to as soft board or FPC, mainly used in mobile phones, notebook computers, digital cameras and other products. "LCD" is liquid crystal display, which is the abbreviation of Liquid Crystal Display. TP is capacitive touch screen. "Bonding" is the transliteration of English bonding. Bonding is a wire bonding method in the chip production process. It is generally used to connect the internal circuit of the chip with the package pins with gold wires before packaging. "ACF (Anisotropic Conductive Film)" is the a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/13H05K3/30
Inventor 聂泉
Owner SHENZHEN LIANDE AUTOMATION EQUIP
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