Device and method for detecting micro-electronic packaging process quality based on photo-thermal imaging

Abstract

The invention discloses a device for detecting micro-electronic packaging process quality based on photo-thermal imaging. The device for detecting the micro-electronic packaging process quality based on the photo-thermal imaging comprises an image acquiring device, a working bench, a control device and a data processing device, wherein the image acquiring device comprises a support cross beam, a translational motion motor, an imaging probe and a light transmitter. The translational motion motor is fixed on the lower lateral face of the cross beam, and the imaging probe is perpendicular to a moving block fixed in the translational motion motor. The light transmitter is connected to the moving block through an adjustable connecting piece, and emitted light is reflected by a sample and then enters the imaging probe by adjusting the adjustable connecting piece. The data processing device is used for processing light images and heat image data acquired by the image acquiring device to obtain correlation coefficient and mean square error statistic coefficient, comparing the correlation coefficient and the mean square error statistic coefficient and a preset threshold value and obtaining process quality evaluation according to a compared result. The device for detecting the micro-electronic packaging process quality based on the photo-thermal imaging can achieve recognition of residual particles, voids and material quality and measurement of microvoid depth and is reliable in detection and evaluation.

Description

technical field [0001] The invention belongs to the field of microelectronic packaging, and more specifically relates to a photothermal imaging-based microelectronic packaging process quality detection device and method. Background technique [0002] Three-dimensional microelectronic packaging technology, that is, three-dimensional electronic packaging technology, is a higher-density electronic packaging that is further developed into space on the basis of two-dimensional planar electronic packaging. This technology can make the corresponding electronic system more functional, better in performance, and reliable. Higher reliability and lower cost. Among them, through-silicon via technology, as a new technology solution for interconnection of stacked chips in three-dimensional integrated circuits, has the following significant advantages: the stacking density of chips in the three-dimensional direction is the largest, the interconnection lines between chips are the shortest, ...

AI Technical Summary

Problems solved by technology

[0003] However, limited by the constraints of feature size, micropore aspect ratio, etc., there are still many process problems to be solved in many TSV technology routes.

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