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Resin composition for sealing solar cell element, and solar cell module

A solar cell and resin composition technology, applied in electrical components, circuits, photovoltaic power generation, etc., can solve the problems of poor thermal stability and inability to show heat resistance, and achieve high adhesion, excellent durability, and low hygroscopicity Effect

Inactive Publication Date: 2013-01-16
ZEON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the use of ethylene-α-olefin copolymers instead of EVA is expected to reduce the impact of acid generation, if not crosslinked, ethylene-α-olefin copolymers cannot exhibit sufficient resistance due to the poor balance of thermal stability and flexibility. hot

Method used

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  • Resin composition for sealing solar cell element, and solar cell module
  • Resin composition for sealing solar cell element, and solar cell module
  • Resin composition for sealing solar cell element, and solar cell module

Examples

Experimental program
Comparison scheme
Effect test

specific example

[0104]Specific examples include 1,2,3,4-butanetetracarboxylic acid, 1,2,2,6,6-pentamethyl-4-piperidinol, and 3,9-bis(2-hydroxy-1,1 -Dimethylethyl)-2,4,8,10-tetraoxaspiro[5,5]undecane mixed ester compound; 1,6-hexanediamine-N,N'-bis(2, 2,6,6-tetramethyl-4-piperidinyl) and morpholino-2,4,6-trichloro-1,3,5-triazine polycondensate; 1-[2-[3- (3,5-di-tert-butyl-4-hydroxyphenyl)propionyloxy]ethyl]-4-[3-3,5-di-tert-butyl-4-hydroxyphenylpropionyloxy ]-2,2,6,6-tetramethylpiperidine, bis-(1,2,2,6,6-pentamethyl-4-piperidinyl) 2-(3,5-di-tert-butyl Base-4-hydroxybenzyl)-2-n-butylmalonate, bis-(1,2,2,6,6-pentamethyl-4-piperidinyl) 2-(3,5-di -tert-butyl-4-hydroxybenzyl)-2-n-butylmalonate, 4-(3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionyloxy)- 1-(2-(3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionyloxy)ethyl)-2,2,6,6-tetramethylpiperidine, 4- (N-(1-benzyl-2-phenethyl)-N-formylamino)-2,2,6,6-tetramethylpiperidine, 4-(N-(2-(1-pyrrolidine Base) ethyl)-N-formylamino)-2,2,6,6-tetramethylpiperidine...

Embodiment 1

[0175] (Preparation of resin composition for encapsulating solar cell elements [A1])

[0176]2.0 parts of (i) N,N'-bis(2,2,6,6-tetramethyl-4-piperidinyl)-1,6-hexanediamine (hindered amine light stabilizer) and 2,4 , a polymer of 6-trichloro-1,3,5-triazine with (ii) N-butyl-1-butylamine and N-butyl-2,2,6,6-tetramethyl-4- The reaction product of piperidinamine ( 2020, manufactured by Ciba Japan) was added to 100 parts of pellets of the hydrogenated block copolymer [A] obtained in Reference Example 1. The mixture was kneaded at 250° C. and extruded in strand form using a twin-screw extruder (TEM35B, manufactured by Toshiba Machine). After cooling with water, the kneaded product was cut using a pelletizer to obtain 95 parts of pellets of the resin composition for encapsulating solar cell elements [A1] containing the hydrogenated block copolymer [A].

[0177] (extruded sheet)

[0178] An extruded sheet [SA1] having a thickness of 400 μm and a width of 500 mm was obtained from ...

Embodiment 2

[0184] (Resin composition for encapsulation of solar cell elements [A2])

[0185] 2.0 parts of the same hindered amine light stabilizer used in Example 1 and 0.2 parts of 2-(2H-benzotriazol-2-yl)-4-(1,1,3,3-tetramethyl Butyl)phenol (benzotriazole UV absorber, 329, manufactured by Ciba Japan) was added to 100 parts of pellets of the hydrogenated block copolymer [A] obtained in Reference Example 1. The mixture was kneaded in the same manner as in Example 1 to obtain 95 parts of pellets of the resin composition [A2] for encapsulating solar cell elements.

[0186] An extrusion-molded sheet [SA2] and a press-molded test specimen [PA2] were prepared in the same manner as in Example 1 from pellets of the resin composition [A2] for encapsulating solar cell elements. Evaluation of light transmittance, water absorption, tensile strength, tensile elongation, volume resistivity, adhesion to glass substrate, encapsulated copper plate using extruded sheet [SA2] and press-molded test spec...

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Abstract

Provided are: a resin composition for sealing a solar cell element which comprises a hydrogenated block copolymer and has a tensile elasticity (at 23oC) of 1.0-500 MPa, said hydrogenated block copolymer being obtained by hydrogenating 90% or more of total unsaturated bonds present in a block copolymer, which comprises at least two polymer blocks [A] having an aromatic vinyl compound-origin repeating unit as the main component and at least one polymer block [B] comprising a chain-type conjugated diene compound-origin repeating unit as the main component and in which the ratio (wA:wB) of the weight fraction (wA) of the total polymer blocks [A], relative to the total block copolymer, to the weight fraction (wB) of the total polymer block [B] is 20:80 to 60:40; and a solar cell module.

Description

technical field [0001] The present invention relates to a resin composition for encapsulating solar cell elements and a solar cell module in which the solar cell elements are sealed with the resin composition. Background technique [0002] In recent years, solar cell elements are attracting attention as clean energy. Various forms of solar cell modules have been proposed and developed. In particular, solar cell modules using monocrystalline or polycrystalline silicon solar cell elements, solar cell modules using thin-film amorphous silicon solar cell elements, and the like are mainly used. A typical solar module using silicon solar cell elements is shown in figure 1 , wherein the assembly has a transparent front substrate made of a glass substrate or the like 1 solar cell element 2, an encapsulation material 3 tightly sealing the solar cell element, and connections leading to the solar cell element arranged in the following order from the sunlight incident side (interconn...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F297/04C08F8/04C08K5/00C08K5/17C08K5/49C08L53/02H01L31/042
CPCC09J153/025Y02E10/52C08K5/005H01L31/0481C08K5/3475C08K5/523C08K5/3492Y02E10/50C08L53/025B32B17/1055
Inventor 棚桥直树小原祯二
Owner ZEON CORP
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