Semiconductor packaging structure

Abstract

The invention discloses a semiconductor packaging structure which comprises a substrate, at least one chip, a packaging colloid and a grapheme layer. The grapheme layer is arranged on the packaging colloid or arranged on the surface e of the chip. By means of the grapheme layer, the semiconductor packaging structure has high planarity heat-conductivity coefficient, facilities lateral heat conductivity, increases even conduction of heat and heat exchange area, and further improves the heat conducting-out efficiency of the chip.

Description

technical field [0001] The present invention relates to a semiconductor packaging structure, in particular to a semiconductor packaging structure that increases the uniform conduction of heat. Background technique [0002] Nowadays, with the miniaturization, multi-function and high-performance of electronic devices such as portable personal computers, smart phones and digital cameras, semiconductor devices must be designed to be smaller and have more functions, thus making semiconductor package structure (semiconductor package) ) are becoming more and more common in the use of many electronic devices. However, the chip tends to generate high temperature during operation, so a heat sink needs to be bonded to the surface of the chip to improve the overall heat dissipation efficiency. A common way to fix the heat sink on the chip is to use thermally conductive adhesive, but it is not easy to control the thickness uniformity of the thermally conductive adhesive when bonding, an...

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Problems solved by technology

[0006] In view of this, the present invention provides a semiconductor packaging structure to solve the problems of uneven heat dissipation and high cost in existing semiconductor packaging structures using indium sheets for heat dissipation

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