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Inner groove porous strengthened boiling micro-channel structure, manufacture method and application

A technology of micro-channel structure and manufacturing method, applied in lighting and heating equipment, indirect heat exchangers and other directions, can solve problems such as large flow resistance, and achieve the effects of low production cost, convenient operation and easy demoulding

Inactive Publication Date: 2013-01-16
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The inner groove porous enhanced boiling microchannel structure has the dual advantages of both the porous structure and the inner concave structure, and makes up for the defect of the large flow resistance of the porous material. It can be expected that it will further enhance the heat and mass transport effect. The internal groove porous enhanced boiling microchannel structure has not been reported yet

Method used

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  • Inner groove porous strengthened boiling micro-channel structure, manufacture method and application
  • Inner groove porous strengthened boiling micro-channel structure, manufacture method and application
  • Inner groove porous strengthened boiling micro-channel structure, manufacture method and application

Examples

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Effect test

Embodiment 1

[0040] A porous reinforced boiling microchannel structure with internal grooves includes a metal sintered felt 4 with uniform particle distribution formed by sintering metal powder, and a number of internal grooves are evenly distributed on the metal sintered felt 4. Such as figure 1 As shown, the cross-sectional shape of the inner groove is an inverted "Ω" shape. The metal powder is copper powder, and the particle shape of the metal powder is spherical.

[0041] The manufacturing method of the above-mentioned inner groove porous enhanced boiling microchannel structure includes the following steps:

[0042] (1) Use wire cutting technology to process flat graphite molds; figure 2 with 3 As shown, the planar graphite mold is composed of three parts: the upper mold 1, the middle mold 2, and the lower mold 3. The lower mold 3 forms an evenly distributed axial convex structure by wire cutting, and the axial convex structure is complementary to the inner groove structure. The shape of ...

Embodiment 2

[0049] This embodiment is the same as Embodiment 1 except for the following features: Figure 8 As shown, the particle shape of the metal powder is dendritic.

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Abstract

The invention discloses an inner groove porous strengthened boiling micro-channel structure, which includes a metal sintered felt formed by sintering metal powder and provided with uniformly-distributed particles, wherein a plurality of inner grooves are uniformly distributed in the metal sintered felt. The porous surface of the inner groove porous strengthened boiling micro-channel structure has excellent capillary characteristics, can keep the wall surface to be sufficiently damp, avoids the local scabbing and polymer deposit caused by hot spot and local drying, improves the heat transfer coefficient and critical heat flux density by adopting the porous structure for strengthened boiling heat transfer, and has excellent strengthened heat transfer effect.

Description

technical field [0001] The invention relates to the technical field of inner groove porous enhanced boiling microchannel structure applied to evaporators such as heat pipe liquid suction cores, vapor chambers, capillary pump rings, etc., heat exchange cores of heat exchangers, etc., and particularly relates to an inner groove Porous enhanced boiling microchannel structure and its manufacturing method and application. Background technique [0002] At present, with the gradual expansion of the energy crisis, energy conservation and effective use of natural resources have become topics of concern all over the world. [0003] Stepping into the 21st century, the integration of various electronic and electrical products is getting higher and higher, the mechanism system is becoming more and more complex, and the power requirements are also increasing. The heat dissipation problem is becoming more and more prominent due to various reasons. Microscale thermal management and thermal...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/04B22F3/11
Inventor 汤勇邓大祥沈玉琴黄光汉
Owner SOUTH CHINA UNIV OF TECH
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