Drying-out-free type die bonding glue and preparation method thereof

A crystal-bonding adhesive and no-baking technology, which is applied in the direction of adhesives, non-polymer organic compound adhesives, etc., can solve the problems of affecting the bonding process, polluting the PCB board, and prone to tailing, etc., achieving long storage period, Good adhesive performance and stable storage

Active Publication Date: 2014-11-05
NICHE TECH KAISER SHANTOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Epoxy resin system die-bonding adhesive has the advantages of strong adhesion and high reliability, but it also has its shortcomings: (1) Due to the high viscosity of epoxy resin itself, it is difficult to control its viscosity at a certain level after adding a curing / accelerator. Within a suitable range, tailing is prone to occur during the high-speed dispensing process, which will pollute the PCB board and affect the next step of the bonding process; (2) The epoxy resin system die-bonding adhesive is a single-component heat-curing type, which requires a relatively Bake at high temperature (120-150°C) for a long time (generally 10-60 minutes) to cure; (3) Epoxy resin system die-bonding adhesive needs to be stored at low temperature (generally 2-8°C), and storage Short term (less than 6 months)
With the continuous improvement of people's requirements for the production efficiency and production cost of chip products, the traditional epoxy resin system die-bonding adhesive has been difficult to meet the demand

Method used

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  • Drying-out-free type die bonding glue and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] The preparation method of this no-baking type crystal-bonding glue comprises the following steps in sequence:

[0022] (1) Take 50Kg (kilogram) of bisphenol A epoxy diacrylate (both bisphenol A epoxy diacrylate with a viscosity of 500000cps and a hydrolyzable chlorine content of 100ppm), 5Kg of reactive diluent (both are methacrylic acid hydroxyl ethyl ester), 3Kg o-sulfobenzimide, 0.5Kg accelerator (both acetophenylhydrazine), 0.15Kg stabilizer (including hydroquinone 0.05Kg, edetate tetrasodium 0.1Kg), and Add to the first reaction vessel that is clean, dry and has a circulating water jacket; then run the circulating water jacket of the first reaction vessel (in this step, the internal water temperature of the circulating water jacket of the first reaction vessel is 75° C.), And stirring the materials in the first reaction vessel (in this step, the stirring speed is 1500 rpm, and the stirring time is 40 minutes); after the stirring is completed, the first semi-finishe...

Embodiment 2

[0027] The preparation method of this no-baking type crystal-bonding glue comprises the following steps in sequence:

[0028](1) Take 50Kg of bisphenol A epoxy diacrylate (both bisphenol A epoxy diacrylate with a viscosity of 700000cps and a hydrolyzable chlorine content of 300ppm), 15Kg of reactive diluent (including 5Kg of hydroxyethyl methacrylate , hydroxypropyl methacrylate 10Kg), 5Kg o-sulfobenzimide, 0.1Kg accelerator (both acetophenhydrazine), 0.11Kg stabilizer (including hydroquinone 0.06Kg, ethylenediamine diacetic acid Tetrasodium 0.05Kg), and join in the first reaction vessel that cleans, dry and have circulating water jacket; Then run the circulating water jacket of the first reaction vessel (in this step, when the circulating water jacket of the first reaction vessel is running, its interior The water temperature is 70°C), and the materials in the first reaction container are stirred (in this step, the stirring speed is 1000 rpm, and the stirring time is 60 minut...

Embodiment 3

[0033] The preparation method of this no-baking type crystal-bonding glue comprises the following steps in sequence:

[0034] (1) Take 50Kg bisphenol A epoxy diacrylate (both bisphenol A epoxy diacrylate with a viscosity of 800000cps and a hydrolyzable chlorine content of 100ppm), 8Kg reactive diluent (both are hydroxypropyl methacrylate ), 1Kg o-sulfobenzimide, 2Kg accelerator (both benzohydrazide), 1Kg stabilizer (both disodium ethylenediaminetetraacetate), and added to a clean, dry and circulating water jacket In the first reaction vessel; then run the circulating water jacket of the first reaction vessel (in this step, the internal water temperature of the circulating water jacket of the first reaction vessel is 80° C.), and stir the materials in the first reaction vessel (In this step, the stirring speed is 1500 rpm, and the stirring time is 50 minutes); after the stirring is completed, the first semi-finished rubber material is obtained;

[0035] (2) 50Kg bisphenol A ep...

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PUM

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Abstract

Disclosed is drying-out-free type die bonding glue. The glue comprises, by weight, 100 parts of bisphenol A epoxy diacrylate, 10-50 parts of ethoxylated bisphenol A dimethacrylate, 5-15 parts of reactive diluents, 1-15 parts of tougheners, 1-5 parts of initiators, 0.1-2 parts of organic acid, 1-5 parts of saccharin, 0.1-2 parts of accelerants and 0.01-1 part of stabilizing agent. The invention also provides a preparation method of the drying-out-free type die bonding glue. The glue has the advantages that the glue can be stored stably at the room temperature, the storage period is long (the storage period is more than 12 months at the room temperature), the bonding performance for printed circuit board (PCB) base plates and chips is good, chips can be solidified quickly without drying after being attached at the room temperature (chips can be solidified primarily within five minutes and wiring requirements are met), the glue has stable and proper viscosity, the trailing phenomenon cannot exist during usage, and process requirements of high-speed dispensing are met.

Description

technical field [0001] The invention relates to an adhesive, in particular to a no-bake type die-bonding adhesive used for chip packaging, and a preparation method of the no-bake type die-bonding adhesive. Background technique [0002] In chip on board (COB for short) packaging or other forms of electronic packaging, it is necessary to use adhesives to fix the chip (that is, to use adhesive to bond the chip to the PCB board) before proceeding to the next step of wire bonding (Wire Bond, that is, binding pins), this type of adhesive is usually called a die-bonding adhesive. [0003] Traditional die-bonding adhesives generally use epoxy resin systems, which are composed of epoxy resins, fillers, curing / accelerators, and other additives. Epoxy resin system die-bonding adhesive has the advantages of strong adhesion and high reliability, but it also has its shortcomings: (1) Due to the high viscosity of epoxy resin itself, it is difficult to control its viscosity at a certain le...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J4/02
Inventor 周振基周博轩
Owner NICHE TECH KAISER SHANTOU
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