Multi-chip packaging structure and multi-chip packaging method

Abstract

Disclosed are multi-chip packaging structures and methods. In one embodiment, a multi-chip packaging structure can include: (i) N chips, where N is an integer of at least two, and where an upper surface of each chip comprises a plurality of pads; (ii) a lead frame with a chip carrier and a plurality of pins, where the N chips are stacked in layers on the chip carrier, and where a chip in an upper layer partially covers a chip in a lower layer such that the plurality of pads of the lower layer chip are exposed; (iii) a plurality of first bonding leads configured to connect pads on one chip to pads on another chip; and (iv) a plurality of second bonding leads configured to connect pads on at least one chip to the plurality of pins for external connection to the multi-chip packaging structure.

Description

technical field [0001] The invention relates to the field of integrated circuits, and more specifically relates to a multi-chip packaging structure and a packaging method thereof. Background technique [0002] In the semiconductor industry, the production of integrated circuits can be divided into three stages: integrated circuit design, integrated circuit manufacturing and integrated circuit packaging. In the manufacture of integrated circuits, chips are completed by the steps of wafer manufacturing, forming integrated circuits, and cutting wafers. After the integrated circuit inside the wafer is completed, a plurality of bonding pads are arranged on the wafer, so that chips formed by dicing the wafer can be electrically connected to a carrier externally through these bonding pads. The carrier is, for example, a lead frame or a package substrate. The chip can be connected to the carrier by wire bonding or flip-chip bonding, so that the pads of the chip can be electrically...

AI Technical Summary

Problems solved by technology

[0007] In view of this, the purpose of the present invention is to provide a novel power integrated circuit chip packaging structure to solve the problems of excessive packaging area, high cost and complicated manufacturing process in the prior art

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