Working platform of plate passive surface acoustic wave filter

A surface acoustic filter and working platform technology, which is applied to electrical components, impedance networks, etc., can solve problems such as time-consuming, and achieve the effects of ensuring the quality of welding wires, saving time and maintenance costs

Active Publication Date: 2014-11-05
RF360 TECH (WUXI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the traditional method is to use fixtures to fix products to ensure the normal process of welding wires, but fixing with fixtures has the following disadvantages: 1. According to market demand, products are becoming more and more diverse in size, and products of different sizes need to be matched with different It takes a lot of time to fix the fixture; 2. The traditional fixture also needs to spend a lot of manpower, material resources and time for maintenance and maintenance to ensure its service life; 3. The use of traditional fixtures is easy to cause potential welding wire quality due to fixing problems problems, such as line collapse

Method used

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  • Working platform of plate passive surface acoustic wave filter
  • Working platform of plate passive surface acoustic wave filter
  • Working platform of plate passive surface acoustic wave filter

Examples

Experimental program
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Embodiment Construction

[0012] See figure 1 , figure 2 , image 3 , the present invention includes a working platform 1, a slide (the slide is not shown in the figure), a control system connected to a wire bonding machine on the working platform 1, and the control system includes a clamp signal interface, a vacuum interface, and a wire feeding fault signal interface (see image 3 ), on the left and right sides of the upper surface 2 of the working platform 1, there are slide transport slots 3 respectively, which are located on the front side of the working platform 1, and two slide positioning pinholes are arranged on the upper surface 2 of the working platform 1 4. The upper surface 2 of the working platform 1 is also provided with a first notch 5 and a second notch 6, and a blind hole 8 is arranged in the body of the working platform 1, and the blind hole 8 opens on the rear side 7 of the working platform 1, and Connect with the first notch 5 and the second notch 6 respectively; the open end 10...

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Abstract

The invention provides a working platform of a plate passive surface acoustic wave filter. The working platform does not need a traditional clamp to fix and locate a product any more, can meet the fixation requirements of products of different sizes, saves time and maintenance cost, and can further ensure wire bonding quality. The working platform of the plate passive surface acoustic wave filter comprises the working platform and a carrying plate, wherein the working platform is connected with a control system of a wire bonder; the control system comprises a clamp signal interface, a vacuum interface and a wire feeding fault signal interface; a left slide conveying trough and a right slide conveying trough are formed on the working platform respectively; and the carrying slide body comprises two rows of corresponding product troughs. The working platform of the plate passive surface acoustic wave filter is characterized in that two notch are further formed on the upper surface of the working platform; a blind hole channel is formed inside the working platform body and is communicated with each of the two notches; the open end of the blind hole channel is connected to a vacuum tube; the vacuum tube is connected with an electromagnetic valve, and the electromagnetic valve is connected with the control system and the clamp signal interface.

Description

technical field [0001] The invention relates to equipment used in the wire bonding process flow of chips in the fields of communication and electronics, in particular to a chip-type passive surface acoustic filter working platform. Background technique [0002] In the chip passive surface acoustic filter production process, after the chip completes the front-end processes such as circuit deposition and exposure, it still needs to go through ceramic packaging processes such as slicing, die bonding, wire bonding, spot welding, and seam welding. During the process, the slides are placed on the working platform, how to effectively fix the products on the slides has always been the key to the quality. At present, the traditional method is to use fixtures to fix products to ensure the normal process of welding wires, but fixing with fixtures has the following disadvantages: 1. According to market demand, products are becoming more and more diverse in size, and products of differen...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H03H3/08
Inventor 刘杭州
Owner RF360 TECH (WUXI) CO LTD
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