Multi-channel water-cooling device structure of computer CPU (Central Processing Unit)

Abstract

The invention provides a multi-channel water-cooling device structure of a computer CPU (Central Processing Unit), which is capable of reducing the temperature of a heating device to be lower than an ambient temperature, can be suitable for various environment occasions, and is wide in application range, and quiet and noiseless. The multi-channel water-cooling device structure comprises an upper-part cover plate and a micro-cutting cooling plate, wherein a water outlet and a water inlet are arranged on the upper end surface of the upper-part cover plate; and the upper-part cover plate is installed on the micro-cutting cooling plate. The multi-channel water-cooling device structure is characterized in that an injecting splitter plate is arranged in a cavity formed by the upper-part cover plate and the micro-cutting cooling plate; at least four parallel channel notches are formed in the injecting splitter plate; the water inlet is communicated to the parallel channel notches along the upper surface of the injecting splitter plate; a heat dissipation region of the micro-cutting cooling plate is arranged below the channel notches; and heat dissipation columns in a rectangular array are distributed in the heat dissipation region of the micro-cutting cooling plate.

Description

technical field [0001] The invention relates to the technical field of computer CPU cooling, in particular to the structure of a multi-channel water cooling device for the computer CPU. Background technique [0002] The current computer CPU cooling generally adopts two methods of air cooling and water cooling. With the continuous development of graphics card processing chips, the heat generated during the work process continues to increase. In order to ensure good heat dissipation performance and normal operation of the graphics card, Its air cooling must be cooled by a high-speed fan, which brings loud noise and vibration, which is annoying. However, in the existing water-cooling cooling method, the cooling effect of the water-cooling module can only reduce the temperature to the ambient temperature at most, which is not suitable for applications where the ambient temperature is relatively high, and its applicable range is small. Contents of the invention [0003] In vie...

AI Technical Summary

Problems solved by technology

[0002] The current computer CPU cooling generally adopts two methods of air cooling and water cooling. With the continuous development of graphics card processing chips, the heat generated during the work process continues to increase. In order to ensure good heat dissipation performance and normal operation of the graphics card, Its air cooling must be cooled by a high-speed fan. The high-speed fan brings loud noise and vibration, which is annoying.

However, in the existing water cooling mode, the cooling effect of the water cooling module can only reduce the temperature to the ambient temperature at most, which is not suitable for applications where the ambient temperature is relatively high, and its scope of application is small

Images