Heat conduction coefficient and contact thermal resistance testing device

Abstract

The invention discloses a heat conduction coefficient and contact thermal resistance testing device. The testing device comprises a control system, a support 3, a first ball sleeve 4-1, a second ball sleeve 4-2, a sliding screw rod 5, an oriented steel ball and a pressure sensor 6, an auxiliary heater 7, a first temperature sensor 8-1, a second temperature sensor 8-2, a vacuum cap 9, a test piece test zone 10, a stress loading device, a vacuum drainage air port 13, water inlet and outlet ports 14, a data acquisition system, a sealing chassis 16, a mounting plate 17, a horizontal adjusting rod 20 and a heater strip 21, wherein a thermal flowmeter 22, the oriented steel ball and the pressure sensor 6, the support 3, the mounting plate 17 and heating refrigeration sleeves 1 are symmetrical in an up-down manner. According to the invention, the auxiliary heater which can reduce the axial heat loss is arranged along the y-direction, and a temperature gradient of a controllable temperature radiation shield simulation test region is arranged at the periphery of the test zone so as to reduce heat loss of a cross section direction.

Description

technical field [0001] The invention belongs to the field of measuring thermal conductivity and contact thermal resistance, and in particular relates to a device for accurately measuring material thermal conductivity and contact thermal resistance. Background technique [0002] The determination of thermal conductivity can be roughly divided into steady-state method and unsteady-state method. The so-called steady-state method is to measure a constant temperature difference of the substance to be measured, and then measure the heat flow formed under the given temperature difference, and the thermal conductivity of the substance can be obtained by Fourier's heat conduction law; the so-called unsteady-state method generally adopts A transient heat source is used for heating, and then the dynamic temperature response of the substance to be determined is measured, and the thermal conductivity of the substance is obtained by analyzing the relationship between the temperature chang...

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Problems solved by technology

Most of the steady-state contact thermal resistance test methods are similar to the test standard equipment of the American National Standard ASTM D5470-06, but many documents point out that it is difficult to guarantee the interface thermal contact resistance due to the uncertainty error of temperature measurement and the error of heat loss. High enough measurement accuracy

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