Ultrathin full-wave rectifier

Abstract

The embodiment of the invention discloses an ultrathin full-wave rectifier which comprises four wafers, four pole contacts and a package glue body, wherein the four wafers are arranged in a quadrilateral shape in a same plane, and polarities of the wafers on adjacent peripheries are in alternating arrangement of different-same in sequence; the pole contacts are divided into an upper-layer group of pole contacts and a lower-layer group of pole contacts; the two pole contacts at the upper layer are respectively used for electrically connecting two wafers with a same polarity on the upper surfaces of the four wafers; the two pole contacts at the lower layer are respectively used for electrically connecting two wafers with different polarities in a same direction on the lower surfaces of the four wafers; and the package glue body is used for packing the wafers and the pole contacts. By adopting the ultrathin full-wave rectifier, a rectifier which is thinner than the conventional rectifier can be produced, and the pin distance between two pins and types of the wafers can be selected according to the actual requirements, so that the ultrathin full-wave rectifier can be applied flexibly, the four wafers are in a plane placing structure, a product can be tightly attached on a radiating surface of a PC (printed circuit) board, relatively good radiating performance can be obtained, the temperature of a PN node can be controlled within a reasonable range, and the working efficiency is improved.

Description

technical field [0001] The invention relates to a rectifier, in particular to an ultra-thin full-wave rectifier. Background technique [0002] At present, the assembly method of the existing bridge rectifiers on the market is vertical assembly, that is, a multi-layer stacked structure in the vertical direction, and the structure is covered with epoxy resin. The packaging method is relatively simple and can be realized on a mold. Sequential packaging has high co-efficiency, but there are also many defects, such as: the positive and negative poles are diagonally positioned, and the volume is large, which is not conducive to the heat dissipation of the internal chip, and is not suitable for highly integrated circuits that require small volume . [0003] The patent announcement number is CN 2369338Y, which discloses a bridge rectifier 01, such as figure 1 As shown, it is packaged in a vertical package, including four chips 02, and every two chips 02 are stacked together, and ...

AI Technical Summary

Problems solved by technology

This prior art is a vertical multi-layer structure, although fast encapsulation can be used, but the manufactured product has a large volume, complex process, more raw materials, poor heat dissipation between material grains, and long-term working In this state, it is easy to cause aging, which will cause the power supply failure of the applied electronic circuit

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