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Low temperature and low pressure BMC (Bulk Molding Compound) material, preparation method thereof and purpose thereof

A low-temperature, low-pressure, low-shrinkage additive technology, applied in the field of BMC materials, low-temperature and low-pressure BMC materials, preparation, can solve the problems of harsh molding conditions, cost waste, energy waste, etc., to shorten the curing time and maintain the effect of fluidity

Active Publication Date: 2012-10-31
WUXI XINHONGTAI ELECTRIC TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The molding temperature of traditional BMC materials is generally ≥140°C, and the molding pressure is generally ≥140kg / cm 2 , the molding conditions are relatively harsh, resulting in waste of energy and cost

Method used

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  • Low temperature and low pressure BMC (Bulk Molding Compound) material, preparation method thereof and purpose thereof
  • Low temperature and low pressure BMC (Bulk Molding Compound) material, preparation method thereof and purpose thereof
  • Low temperature and low pressure BMC (Bulk Molding Compound) material, preparation method thereof and purpose thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0080] A BMC material comprises the following components by mass percentage:

[0081]

[0082] The preparation method is:

[0083] (1) Stir the unsaturated resin, low shrinkage additive, auxiliary agent, curing agent and polymerization inhibitor in the disperser for 20 minutes;

[0084] (2) Add release agent and pigment to the mixture obtained in step (1) and stir for 20 minutes at a speed of 1000 rpm to obtain a resin paste;

[0085] (3) Put the filler into the kneader, stir for 3 minutes, and the speed is 3000 rpm;

[0086] (4) Add the resin paste obtained in step (2) into the kneader described in step (3), and stir for 3 minutes; then add 10% of the glass fiber in the formula and stir together, and then add the remaining glass fiber to stir and disperse, the material manufacture complete.

Embodiment 2

[0088] A BMC material comprises the following components by mass percentage:

[0089]

[0090] The preparation method is:

[0091] (1) Stir the unsaturated resin, low shrinkage additive, auxiliary agent, curing agent and polymerization inhibitor in the disperser for 3 minutes;

[0092] (2) Add release agent and pigment to the mixture obtained in step (1) and stir for 3 minutes at a speed of 3000 rpm to obtain a resin paste;

[0093] (3) Add the filler into the kneader, stir for 20 minutes, and rotate at 1000 rpm;

[0094] (4) Add the resin paste obtained in step (2) into the kneader described in step (3), and stir for 20 minutes; then add 10% of the glass fiber in the formula and stir together, and then add the remaining glass fiber to stir and disperse, the material manufacture complete.

Embodiment 3

[0096] A low-temperature and low-pressure BMC material includes the following components by mass percentage:

[0097]

[0098] The preparation method is:

[0099] (1) Stir the unsaturated resin, low-shrinkage additive, auxiliary agent, curing agent, and polymerization inhibitor in the disperser for 6 minutes;

[0100] (2) Add release agent and pigment to the mixture obtained in step (1) and stir for 4 minutes at a speed of 1800 rpm to obtain a resin paste;

[0101] (3) Add the filler into the kneader, stir for 5 minutes, and rotate at 2000 rpm;

[0102] (4) Add the resin paste obtained in step (2) into the kneader described in step (3), and stir for 12 minutes; then add 10% of the glass fiber in the formula and stir together, and then add the remaining glass fiber to stir and disperse, the material manufacture complete.

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Abstract

The invention relates to a low temperature and low pressure BMC (Bulk Molding Compound) material. The low temperature and low pressure BMC material comprises unsaturation resin, a low shrinkage additive, a filler, a curing agent, a mold release agent, a polymerization inhibitor, an auxiliary and glass fiber, wherein the mold release agent is a mixture of zinc stearate and calcium stearate. The molding temperature of the low temperature and low pressure BMC material provided by the invention is only 110-130 DEG C and is reduced by about 30% when compared with the molding temperature of the traditional BMC molding material; and the molding pressure of the low temperature and low pressure BMC material provided by the invention is only 70-100 kg / cm2 and is reduced by about 50% when compared with the molding pressure of the traditional BMC molding material.

Description

technical field [0001] The invention relates to a BMC material, in particular to a low-temperature and low-pressure BMC material, a preparation method and an application thereof, and belongs to the technical field of composite insulating materials. Background technique [0002] Compression molding (also known as compression molding or compression molding) is the operation of first putting powdery, granular or fibrous plastics into the mold cavity at the molding temperature, and then closing the mold and pressing it to form and solidify. The molding process can be divided into fiber molding method, rag molding method, fabric molding method, laminate molding method, winding molding method, sheet plastic (SMC) molding method, preformed blank according to the state of the reinforcing material and the type of molding material. Molding method, etc. The type of molding material can be any one of prepreg material, premixed material or blank. The types of molding material used in th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L67/06C08L25/06C08K13/04C08K3/26C08K3/22C08K5/14C08K7/14C08K5/08C08K5/13B29C43/58
Inventor 黄增琦赵敏海季玲夏宏伟
Owner WUXI XINHONGTAI ELECTRIC TECH CO LTD
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