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Three-dimensionally wrapped packaged LED (Light Emitting Diode) chip

A LED chip and three-dimensional technology, applied in the direction of electric solid-state devices, semiconductor devices, electrical components, etc., can solve the problem of low light utilization rate of LED chips, achieve the effect of reducing loss, reducing cost, and simple coating process

Inactive Publication Date: 2012-10-24
SHANGHAI DANGOO ELECTRONICS TARDING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a three-dimensional encapsulation LED chip in order to overcome the disadvantage of low light utilization rate of the LED chip due to the existing packaging structure in the manufacture of the LED chip

Method used

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  • Three-dimensionally wrapped packaged LED (Light Emitting Diode) chip
  • Three-dimensionally wrapped packaged LED (Light Emitting Diode) chip
  • Three-dimensionally wrapped packaged LED (Light Emitting Diode) chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Depend on figure 1 As shown, a single flip-chip LED chip 3 is placed in a spherical housing 1 made of transparent material, and the inner wall of the housing is coated with a phosphor layer 2 to three-dimensionally cover the LED chip. The crystal pad 4 is connected to the wire 5, and the single flip-chip LED chip placed in the transparent casing is fixed by pouring transparent silica gel 6.

Embodiment 2

[0022] Depend on figure 2 As shown, a single positive-mounted LED chip 7 is placed in a spherical housing 1 made of transparent material, and the inner wall of the housing is coated with a phosphor layer 2 to three-dimensionally cover the LED chip. It is connected with the gold wire 8 and the wire 5, and the single positive LED chip 7 placed in the transparent casing is fixed by pouring transparent silica gel 6.

Embodiment 3

[0024] Depend on image 3 As shown, a single flip-chip LED chip 3 is directly connected to the wire 5 through the eutectic solder joint 4 . Coat the phosphor powder around the six sides of the LED chip by spraying, dipping and other processes to form a phosphor layer 2, and wrap it with a film 1 made of transparent material and fix it, and evenly coat the LED chip around to form a three-dimensional light emission .

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Abstract

The invention discloses a three-dimensionally wrapped packaged LED (Light Emitting Diode) chip, which is characterized in that six planes of a vertically packaged or inversely packaged single LED chip or series-parallel connected LED chips are coated with fluorescent powder and are fixed by using transparent materials at the periphery, so as to carry out three-dimensional packaging; or a single LED chip or a plurality of series-parallel connected LED chips adopt a vertical or inverse structure and are put into a spherical or tubular shell made of transparent materials; the LED chips are wrapped three-dimensionally by coating a fluorescent powder layer on the inner wall of the shell or mixing the fluorescent powder into the transparent materials; or the LED chips are firstly wrapped by using transparent materials, and subsequently the fluorescent powder is coated on the transparent materials; or the three-dimensional wrapping is carried out by adding a layer of transparent shell material after the coating of the fluorescent powder so as to protect the fluorescent powder. The chip has the beneficial effects that a simplest fluorescent powder wrapping process is adopted so as the make the LED chip emit light in all directions; and in comparison with a traditional single side light emission mode, the loss on light emission of the LED chip is reduced.

Description

technical field [0001] The invention relates to an LED chip, in particular to a three-dimensional wrapping packaged LED chip, and belongs to the field of LED chip manufacturing. Background technique [0002] LED is a light-emitting diode (LED, Lighting emitted diode), which is a solid-state light-emitting device that uses the PN junction to emit light under the action of an electric field. With the characteristics of high life / environmental protection / energy saving, it is a new green light source. LED technology is becoming more and more mature. At present, LEDs usually emit white light through blue chips to excite yellow-green phosphors, and then adjust the wavelength to produce white light. The efficiency of warm white light produced on a large scale in the market reaches 120 lm / W, surpassing most traditional LEDs. light source. Generally speaking, LED grows p-type layer, n-type layer and p-n junction light-emitting layer on sapphire substrate or silicon carbide subs...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/48H01L33/50
CPCH01L2924/0002H01L33/54H01L2224/48091H01L33/50H01L2224/73265H01L25/0753H01L2924/00014
Inventor 瞿崧严华锋文国军
Owner SHANGHAI DANGOO ELECTRONICS TARDING
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