Phosphorus diffusion technology of solar cell silicon wafer
A solar cell and phosphorus diffusion technology, which is applied in the field of phosphorus diffusion technology, can solve the problems of low light conversion efficiency of the battery, reduce the Isc and Uoc of the battery, and high concentration, so as to improve the light conversion efficiency, improve the uniformity of square resistance, and reduce the concentration. Effect
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Embodiment 1
[0015] 1) Put the textured silicon wafer into the diffusion furnace tube, raise the temperature of the furnace tube to 730°C, the heating time is 600s, and at the same time inject 15000ml of oxygen;
[0016] 2) Keep the temperature in the furnace tube at 730°C constant for 600s, and inject 10000ml of oxygen;
[0017] 3) Variable temperature pre-deposition, the temperature is raised from 730°C to 770°C, nitrogen is 5000ml, source oxygen is 800ml, oxygen is 200ml, and the time is 720s;
[0018] 4) Main diffusion, variable temperature propulsion, temperature rises from 770°C to 830°C, nitrogen 10000ml, oxygen 2900ml, time 360s;
[0019] 5) Cool down, drop the temperature in the furnace tube to 750°C, 15000ml of nitrogen, and the time is 720s;
[0020] 6) Push the boat, the nitrogen is 15000ml, and the time is 300s.
Embodiment 2
[0022] 1) Put the textured silicon wafer into the diffusion furnace tube, raise the temperature of the furnace tube to 790°C, the heating time is 700s, and at the same time inject 10000ml of oxygen;
[0023] 2) Keep the temperature in the furnace tube at 790°C constant for 1200s, and inject 5000ml of oxygen;
[0024] 3) Variable temperature pre-deposition, raise the temperature from 790°C to 830°C, nitrogen 5000ml, source oxygen 1400ml, oxygen 200ml, time 1200s;
[0025] 4) Main diffusion, variable temperature propulsion, temperature rises from 830°C to 850°C, nitrogen 5000ml, oxygen 2000ml, time 600s;
[0026] 5) Lower the temperature, lower the temperature in the furnace tube to 810°C, the nitrogen gas is 15000ml, and the time is 1200s;
[0027] 6) Push the boat, the nitrogen is 15000ml, and the time is 600s.
Embodiment 3
[0029] 1) Put the textured silicon wafer into the diffusion furnace tube, raise the temperature of the furnace tube to 750°C, the heating time is 650s, and at the same time inject 12000ml of oxygen;
[0030] 2) Keep the temperature in the furnace tube at 750°C constant for 800s, and inject 5000ml of oxygen;
[0031] 3) Variable temperature pre-deposition, increase the temperature from 750°C to 800°C, 8000ml of nitrogen, 1000ml of oxygen, 500ml of oxygen, and 1000s;
[0032] 4) Main diffusion, variable temperature propulsion, temperature rises from 800°C to 850°C, nitrogen 8000ml, oxygen 2500ml, time 400s;
[0033] 5) Lower the temperature, lower the temperature in the furnace tube to 800°C, the nitrogen gas is 12000ml, and the time is 900s;
[0034] 6) Push the boat, the nitrogen is 12000ml, and the time is 500s.
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