Micro electrochemical machining device and machining method for discontinuous microstructures on inner wall of micro heat pipe

Abstract

The invention discloses a micro electrochemical machining device for discontinuous microstructures on the inner wall of a micro heat pipe, which comprises an electric conducting and liquid conducting rod, a guide device and a working cone body, wherein the guide device surrounds the electric conducting and liquid conducting rod and can prevent the electric conducting and liquid conducting rod from horizontally jittering; the upper end of the working cone body is fixed at the lower end of the electric conducting and liquid conducting rod, and the central axis of the electric conducting and liquid conducting rod coincides with the working cone body; and the working cone body is a conical structure with narrow lower end and wide upper end, and a plurality of spiral line insulating tapes are coated on the outer surface of the working cone body. Meanwhile, the invention also discloses a micro electrochemical machining method for discontinuous microstructures on the inner wall of the micro heat pipe by using the electrochemical machining device. Different sizes and different shapes of complex discontinuous microstructures are formed on the inner surface of the micro heat pipe via electrolysis through two forward and backward rotary feeding of a variable cross-section multiline spiral electrode. The method is simple to operate, and the difficulty of making surface microstructures is effectively solved.

Description

technical field [0001] The invention relates to the technical field of micro-electrolytic machining, in particular to a micro-electrolytic machining device and a processing method with a discontinuous microstructure on the inner wall of a micro-heat pipe. Background technique [0002] In the power electronics industry, the high frequency and high speed of microelectronic devices and the density and miniaturization of integrated circuits make the dissipation power of electronic devices increase rapidly, and the heat generation increases sharply. Conventional cooling methods can no longer meet the requirements. Electronic devices The heat dissipation has become a bottleneck in its development. [0003] Enhanced heat transfer technology refers to a new energy-saving technology that can significantly improve heat transfer performance. Micro heat pipes with enhanced heat transfer structures have become ideal components for heat conduction in high heat flux density microelectroni...

AI Technical Summary

Problems solved by technology

The extrusion-cutting method is only suitable for processing the continuous microstructure of the inner surface of the micro heat pipe; the laser processing method is limited by the size of the laser head, and it is difficult to process deep into the inner wall of the micro heat pipe; Realize the processing of a large number of microstructures on the inner surface of the micro heat pipe; the material removal process in the electrolytic machining process is carried out in the form of ions, which makes it have great development potential in the field of micro-manufacturing and nano-manufacturing

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