Equipment and operation method for improving rapid thermal processing productivity of wafers

Abstract

The invention discloses equipment and an operation method for improving the rapid thermal processing productivity of wafers. The equipment includes at least one processing procedure module, a base body, a front end control interface and a rear end control interface, wherein each processing procedure module includes at least one processing procedure cavity, a loading end, an unloading end, a mechanical arm and a cooling device; the loading end and the unloading end are combined-type cassettes used for accommodating multiple-piece graphite bearing plates in a layered manner; and the multiple-piece graphite bearing plates are provided with carving grooves, so as to load wafers of various sizes. The cassettes are designed to be the multiple-piece graphite bearing plates capable of accommodating and loading wafers, so that operation of the mechanical arm during the processing procedure is reduced, and rapid thermal processing for a plurality of wafers can be performed at the same time, the productivity in unit time can be greatly improved, the flexibility of the processing procedure and the compatibility of the equipment are improved, the time for processing procedure is saved, and the fragment probability of wafers is reduced.

Description

technical field [0001] The present invention relates to a device and an operation method for increasing the production capacity of wafer rapid heat treatment, and in particular to an equipment and an operation method for improving the production capacity of wafer rapid heat treatment, which can simultaneously carry multiple graphite carriers by changing the structure of the cartridge. Background technique [0002] refer to figure 1 and figure 2 , are respectively the top view of the prior art rapid heat treatment equipment and the flow chart of the prior art rapid heat treatment operation method. Such as figure 1 As shown, the prior art rapid heat treatment equipment 1 includes a base body 10, at least one process chamber 20, a loading end 35, an unloading end 45, a robot arm 50, a cooling and separation device 65, a front control interface 70, and a centering The device 90, wherein the loading end 35 and the unloading end 45 are generally used for accommodating multiple...

AI Technical Summary

Problems solved by technology

[0004] The equipment and operation method of rapid heat treatment in the prior art have the following disadvantages. For example, only a single wafer can be processed per unit time, which cannot meet the needs of current production capacity. In addition, there is only one front-end control interface 70. When it is desired to perform maintenance , testing or small-scale production, it is necessary to cancel the automatic process parameters first, which is inconvenient to operate. In addition, after a period of use, if the precision between the components is not accurate, if the wafer cannot be placed in the position, it will be difficult to operate during the operation steps. The problem of fragmentation may occur, which will affect the production capacity, quality and production cost

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