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Optimum design method of heat sink based on Taguchi method

An optimized design and heat sink technology, applied in the direction of instruments, calculations, special data processing applications, etc., can solve the problems of design cost and cycle waste, unable to optimize the heat sink, unable to guarantee the heat sink parameters, etc., to solve the problem of uncertainty , saving design costs and shortening the design cycle

Inactive Publication Date: 2013-12-04
BEIHANG UNIV
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  • Application Information

AI Technical Summary

Problems solved by technology

In the traditional heat sink design process, it relies more on the experience of the designer, if it is successful, it will continue to be used, and if it cannot meet the actual needs, it will be replaced
This design method has two major disadvantages. First, the traditional method cannot optimize the selected radiator, and cannot guarantee that the selected radiator parameters are the optimal situation under the current conditions; secondly, the traditional selection method has hysteresis. Design changes often occur after power device failures, resulting in waste of design costs and cycles

Method used

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  • Optimum design method of heat sink based on Taguchi method
  • Optimum design method of heat sink based on Taguchi method
  • Optimum design method of heat sink based on Taguchi method

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Embodiment Construction

[0059] In the following, the present invention will be further described in detail in conjunction with the accompanying drawings and an optimal design case of a heat sink for a high-power device of an electronic device.

[0060] See figure 1 , the present invention is a kind of heat sink optimal design method based on Taguchi method, and the concrete steps of this method are as follows:

[0061] Step 1: Case introduction and parameter selection

[0062] As a case board such as figure 2 As shown, the size of the circuit board is 180mm×100mm×2mm, including 7 different types of electronic components. The total power consumption of the board is 14.5W.

[0063] Among them, the electronic components in the middle of the circuit board are high-power devices, and their heat dissipation power consumption is 4W, accounting for 27.6% of the total power consumption of the printed circuit board. The external dimensions of the high-power device are 30mm×30mm×2mm, and its packaging form...

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Abstract

An optimum design method of a heat sink based on the Taguchi method comprises selecting controllable factors and a noise factor; designing an experimental program; performing experiment; analyzing an experimental result; executing the Taguchi method on the experimental result; and finally determining the optimum design by the experiment. The invention adopts simulation combined with Taguchi parameter design, carries out experimental design on relevant parameters of the heat sink, then simulates the heat dissipation effect (power device housing temperature) and heat sink quality by means of simulation method, and analyzes the simulation result, to thereby optimize heat sink parameters and research optimum combination of heat sink parameters. The method has practical value in the technical field of avionic product reliability engineering.

Description

(1) Technical field: [0001] The present invention relates to a radiator optimization design method for high-power electronic components of avionics equipment, in particular to a radiator optimization design method based on the Taguchi method, which uses the parameter design of the Taguchi method to select high-power electronic components The parameters of the radiator are selected, and by comprehensively weighing the quality of the radiator and the heat dissipation effect, the optimal radiator parameters are selected to achieve the purpose of optimization. This method belongs to the technical field of reliability engineering of avionics products. (two) background technology: [0002] With the rapid development of my country's aerospace industry, a large number of electronic systems have become the main components of weapons and equipment, and the reliability of electronic equipment has become an important factor affecting the combat capability of weapons and equipment. As an...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F17/50
Inventor 李楠付桂翠谷瀚天张栋
Owner BEIHANG UNIV
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