Multiwire cutting machine and wiring device thereof

Abstract

The invention provides a wiring device of a multiwire cutting machine, which is used for wiring the multiwire cutting machine. The wiring device comprises a first driving main shaft, a second driving main shaft, a third driving main shaft and a fourth driving main shaft, wherein a working mode of a driving motor of at least one driving main shaft is set into a torque control mode; the torque directions of the driving motors are the same as the rotation directions of the driving main shafts, so that the rotation frictions of part of the driving main shafts are counteracted; the torque of each driving motor is set to be less than friction torque of each driving main shaft, so that the friction torque of each driving main shaft is counteracted with the torque set on each driving motor; the torque of each driving motor is less than the friction torque of each driving main shaft, so that each driving main shaft is kept in a static state when wiring is not performed; and outer force can be used for wiring the cutting machine by only counteracting the friction torque of part of the driving main shafts, so that resistance of a roller system during wiring is reduced, the wiring time is shortened, and the wiring speed of the multiwire cutting machine is increased.

Description

technical field [0001] The invention relates to the technical field of wire cutting technology, and more specifically relates to a multi-wire cutting machine and a multi-wire cutting machine wiring device. Background technique [0002] Multi-wire cutting is a high-speed reciprocating motion of metal wires, bringing abrasives into the semiconductor processing area for grinding, cutting hard and brittle materials such as semiconductors into hundreds to thousands of thin slices at a time or cutting cylindrical silicon blocks into squares A new cutting method of cutting silicon blocks or polycrystalline silicon ingots into square silicon blocks. [0003] Silicon wafers are the main production materials in the semiconductor and photovoltaic fields. Silicon wafer multi-wire cutting technology is a relatively advanced silicon wafer processing technology in the world at present. It is different from traditional cutting methods such as saw blades and grinding wheels, and is also diff...

AI Technical Summary

Problems solved by technology

When wiring a multi-wire cutting machine, it is necessary to wind a very long metal wire on dozens of rollers. Due to the large number of rollers that need to be wound, the resistance is large, and the pulling of the metal wire cannot drag the entire roller system. Currently, the control The system controls the take-up and pay-o...

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