Semiconductor package and fabrication method thereof

Abstract

A semiconductor package is provided, which includes a substrate unit having conductive pads and ESD protection pads formed on a bottom surface thereof; an encapsulant covering a top surface of the substrate unit; and a metal layer disposed on a top surface of the encapsulant and having connecting extensions formed on side surfaces of the substrate unit and the encapsulant for electrically connecting the ESD protection pads, wherein portions of the side surfaces of the substrate unit corresponding in position to the conductive pads are exposed from the metal layer so as to ensure that solder bumps subsequently formed to connect the conductive pads of the semiconductor package to a circuit board are not in contact with the metal layer, thereby effectively avoiding the risk of short circuits.

Description

technical field [0001] The invention relates to a semiconductor package and its manufacturing method, in particular to a semiconductor package with a metal layer for preventing short circuit and preventing electromagnetic wave interference and its manufacturing method. Background technique [0002] With the evolution of semiconductor technology, semiconductor products have developed different packaging product types, and in order to improve electrical quality, many semiconductor products have a shielding function to prevent electromagnetic interference (EMI). [0003] At present, in semiconductor packages, a metal layer is plated on the entire top surface and side surfaces of the package, and the metal layer on the side surface is connected to the ground plane (Ground plane) of the circuit board to achieve EMI barrier (Shielding) )Effect. [0004] However, generally, no circuit is designed on the side of the semiconductor package. If additional circuits are required to cond...

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Problems solved by technology

[0007] However, if Figure 1C As shown, in the subsequent manufacturing method, when the package is arranged on the circuit board 5, each of the electrostatic discharge protection pads 101 and the electrical contact pads 100 are combined to the circuit board 5 through solder bumps 4, and then soldered , the solder bumps 4 on the electrical contact pads 100 at the edge of the substrate unit 10 are likely to bridge to the metal layer 12 on the side surface 10c of the substrate unit 10, resulting in a short circuit between the electrical contact pads 100

In addition, if the material of the metal layer 12 is a solderable material, the situation that the electrical contact pad 100 bridges with the metal layer 12 to cause a short circuit is even more serious.

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