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Water-soluble hot melt adhesive for wafer bonding in crystal processing process and preparation method thereof

A water-soluble hot-melt adhesive and processing technology, applied in stone processing equipment, adhesives, manufacturing tools, etc., can solve problems such as environmental pollution, high bonding strength, and restricted development, and achieve the effect of no pollution to the environment and easy removal

Inactive Publication Date: 2012-07-18
BIOCHEM ENG COLLEGE OF BEIJING UNION UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these adhesives generally have high bonding strength, and there are disadvantages such as inconvenient cleaning and removal from the wafer; and the solvent used in the post-processing process may cause environmental pollution; this undoubtedly limits the development of this industry
Patent CN101518882 provides a large-scale and precise production process for circular quartz wafers, but the production process does not have relevant content about adhesives; and patent CN101973080A provides a cutting process for quartz rods, but the cutting process uses Anaerobic adhesives are only used during the cutting process of quartz rods, not subsequent processing

Method used

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  • Water-soluble hot melt adhesive for wafer bonding in crystal processing process and preparation method thereof
  • Water-soluble hot melt adhesive for wafer bonding in crystal processing process and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] With the water-soluble polyester of 100 parts by weight (water-soluble polyester is the DX-70 type water-soluble polyester that Yichang Jiuwan Polyester Material Co., Ltd. produces), the glyceryl monostearate of 15 parts by weight is added to belt In a heated mixer, heat to 150°C, stir well to make the material mix evenly (about 30min), then discharge and cool to shape. The fluidity of the hot melt adhesive is 8min / (10cm, 150°C, g) (a metal plate with an elevation angle of 75°), that is, at 150°C, 1g of the above hot melt adhesive flows 10cm on a stainless steel plate with an elevation angle of 75° The time is 8 minutes; the dissolution time of the adhesive in boiling water is about 5 minutes; the bonding strength can meet the requirements of machining, that is, it will not crack during machining. Coat on the wafer surface with the hot melt adhesive of embodiment 1, pressurize and cool and implement bonding; After bonding, carry out mechanical processing; After mechanic...

Embodiment 2

[0022] With the water-soluble polyester of 85 parts by weight (water-soluble polyester is the DX-70 type water-soluble polyester that Yichang Jiuwan Polyester Material Co., Ltd. produces), the rosin of 15 parts by weight or modified rosin, 15 parts by weight Add a few glyceryl monostearate into a mixer with heating, heat to 150°C, stir well to make the material mix uniformly (about 30min), discharge, and cool to form. The fluidity of the hot melt adhesive is 5min / (10cm, 150°C, g) (a metal plate with an elevation angle of 75°), that is, at 150°C, 1g of the above hot melt adhesive flows 10cm on a stainless steel plate with an elevation angle of 75° The time is 8 minutes; the dissolution time of the adhesive in boiling water is about 5 minutes; the bonding strength can meet the requirements of machining, that is, it will not crack during machining. Coat the hot melt adhesive of embodiment 2 on the wafer surface, pressurize and cool to implement bonding; after bonding, carry out m...

Embodiment 3

[0024] With the water-soluble polyester of 80 parts by weight (water-soluble polyester is the DX-70 type water-soluble polyester that Yichang Jiuwan Polyester Material Co., Ltd. produces), the rosin of 20 parts by weight or modified rosin, 15 parts by weight Add a few glyceryl monostearate into a mixer with heating, heat to 150°C, stir well to make the material mix uniformly (about 30min), discharge, and cool to form. The fluidity of the hot melt adhesive is 4min / (10cm, 150°C, g) (a metal plate with an elevation angle of 75°), that is, at 150°C, 1g of the above hot melt adhesive flows 10cm on a stainless steel plate with an elevation angle of 75° The time is 8 minutes; the dissolution time of the adhesive in boiling water is about 5 minutes; the bonding strength can meet the requirements of machining, that is, it will not crack during machining. Coat the hot melt adhesive of embodiment 3 on the wafer surface, pressurize and cool to implement bonding; after bonding, carry out m...

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Abstract

Water-soluble hot melt adhesive for temporary bonding is mainly used for the precise processing process of crystal materials such as quartz and monocrystalline silicon and has a function of temporary bonding. The hot melt adhesive adopts water-soluble polyester as matrix resin, rosin or modified rosin as a thickening agent, and any one of or a composition formed by any two of glycerin monostearate, triethyl phosphate, ethylene glycol, glyceryl triacetate and the like as a modifying agent. Compared with a traditional product, the hot melt adhesive can meet requirements of precise processing, most of the hot melt adhesive can be removed by using hot water, and all hot melt adhesive can be removed by continuously using 30w% of sodium hydroxide solution. In addition, the hot melt adhesive has the advantages of being removed through hot water and ordinary alkali liquor and does not pollute the environment.

Description

technical field [0001] The water-soluble hot-melt adhesive of the invention belongs to the field of new materials, and is used in the precise processing of crystal materials such as quartz and single crystal silicon to play the role of temporary bonding. Background technique [0002] With the development of science and technology, quartz crystal devices and single crystal silicon devices are gradually miniaturized. In order to meet the demand for precise processing of the above-mentioned crystal materials, it is necessary to bond the wafers into crystal ingots during the processing of the above-mentioned crystals, and then carry out precision processing such as rounding, grinding, and polishing. The traditional process has the disadvantages of low production efficiency and poor positioning accuracy. Although modern processes such as hot melt adhesives can already produce related crystal products. However, these adhesives generally have high bonding strength, and there are ...

Claims

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Application Information

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IPC IPC(8): C09J167/00C09J193/04C09J11/06B28D5/00
Inventor 马榴强娄金萍马士成
Owner BIOCHEM ENG COLLEGE OF BEIJING UNION UNIV
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