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Semi-solidified sheet cutting method

A prepreg and cutting technology, which is applied in metal processing and other directions, can solve the problem that the circuit board cannot meet the requirements of improving impedance signal interference

Inactive Publication Date: 2014-11-05
BOARDTEK COMP SUZHOU +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the circuit boards produced by the current prepreg cutting method cannot meet the needs of improving impedance and reducing signal interference

Method used

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  • Semi-solidified sheet cutting method
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  • Semi-solidified sheet cutting method

Examples

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Embodiment Construction

[0018] figure 1 It is a flowchart of a method for cutting a prepreg in a preferred embodiment of the present invention. Figure 2A versus Figure 2B It is a partial schematic diagram of a cutting device and a cutting auxiliary board according to a preferred embodiment of the present invention. image 3 It is a schematic diagram of a rectangular prepreg before and after cutting in a preferred embodiment of the present invention. Please refer to figure 1 , Figure 2A , Figure 2B and image 3 .

[0019] Such as image 3 As shown, the prepreg cutting method provided in this embodiment is used to cut a rectangular prepreg 2 to obtain another rectangular prepreg 3. Wherein, the lengths of the two adjacent sides of the rectangular prepreg 2 can be equal or unequal, as long as the angle between the adjacent sides is 90 degrees. In addition, the size of another rectangular prepreg 3 obtained by cutting can be appropriately adjusted as required.

[0020] In this embodiment, the rectangu...

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Abstract

The invention discloses a semi-solidified sheet cutting method which comprises the following steps that: a cutting device and a cutting auxiliary plate which is propped against the cutting device are provided; a second auxiliary side of the cutting auxiliary plate is connected with a first auxiliary side and a third auxiliary side and is vertical to the first auxiliary side; and an included angle between the first and the third auxiliary sides is 10 degrees. After a first side to be cut is propped against the third auxiliary side, the cutting device cuts a rectangular semi-solidified sheet along a direction which is in parallel with a preset direction of the first auxiliary side to form a first cut side. After a second side to be cut is propped against the third auxiliary side, the cutting device cuts the rectangular semi-solidified sheet along the preset direction to form a second cut side. The cutting device cuts the rectangular semi-solidified sheet along the direction which is in parallel with the direction of the first cut side. The cutting device cuts the rectangular semi-solidified sheet along the direction which is in parallel with the direction of the second cut side. Consequently, the impedance property of a circuit board which is manufactured from the semi-solidified sheet can be improved and the signal interference can be reduced.

Description

Technical field [0001] The invention relates to a cutting method, and in particular to a cutting method of a prepreg. Background technique [0002] Recently, prepregs are widely used in circuit board technology. The prepreg (also called resin glass fiber cloth or glass fiber resin board) is mainly composed of resin and reinforced materials. Reinforced materials include glass fiber cloth, composite materials and many other types. The current prepreg is a sheet material obtained by impregnating a resin with a processed reinforced material (for example, glass fiber cloth). [0003] Currently, the rectangular prepregs are usually cut into smaller rectangular prepregs in a direction parallel to the four sides of the circuit board according to the size of the circuit board to be manufactured. However, the circuit boards manufactured by the current cutting method of prepregs cannot meet the requirements of improving impedance and reducing signal interference. Summary of the invention ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B26D3/02
Inventor 刘华马宏程李清雄林清培杨德铭
Owner BOARDTEK COMP SUZHOU
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