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Flex-rigid combined board and manufacturing method of flex-rigid combined board

A technology of rigid-flex board and manufacturing method, which is applied in the structural connection of printed circuits, printed circuit parts, printed circuit assembly of electrical components, etc., and can solve the problem of uneven board surface and poor bonding effect of soft board cover film and prepreg Good, soft board is easy to break and other problems, to achieve the effect of uniform glue flow, avoid soft board breakage, and increase support strength

Inactive Publication Date: 2012-06-27
SHENZHEN SUNTAK MULTILAYER PCB
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Problems solved by technology

[0008] In view of the above problems, the object of the present invention is to provide a rigid-flexible board and its manufacturing method to solve the problem that the soft board is easy to break, the soft board cover film and the two-layer prepreg window between the hard board and the soft board are large. The bonding effect of the prepreg is not good, and the board surface is uneven after pressing, etc.

Method used

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  • Flex-rigid combined board and manufacturing method of flex-rigid combined board
  • Flex-rigid combined board and manufacturing method of flex-rigid combined board

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Embodiment Construction

[0026] In order to illustrate the idea and purpose of the present invention, the present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0027] The present invention provides a rigid-flex board and its manufacturing method. It mainly opens windows of different sizes on the two layers of prepreg between the soft and hard boards, and the soft board covering film is located in the above-mentioned windows, and Overlap and press one of them to achieve the purpose of increasing the support strength and avoiding the breakage of the soft board, while ensuring the bonding effect of the soft board cover film and the curing sheet; improving the flatness of the rigid-flex joint of the circuit board.

[0028] Such as figure 2 as shown, figure 2 It is a structural schematic diagram of the rigid-flex board of the present invention. A rigid-flex board according to the present invention includes a hard board 201 and a soft...

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Abstract

The invention discloses a manufacturing method of a flex-rigid combined board, comprising the following steps of: A. carrying out grinding and roughening on the surface of a hard board and covering a second prepreg on the roughened surface according to the pin positions on the surface of the board; B. covering a first prepreg on the second prepreg according to the pin positions; C. covering a soft board on the first prepreg according to the pin positions; and D. carrying out lamination on the soft board, the first prepreg, the second prepreg and the hard board. Compared with the prior art, the manufacturing method has the advantages that the fracture of the soft board is effectively avoided, the combining effect of a soft board covering film and the prepregs is improved, the flatness of the flex-rigid combined positions is ensured and the problems of holes and depressions in lamination are avoided.

Description

Technical field: [0001] The invention belongs to the technical field of circuit board production, and in particular relates to a rigid-flex board and a production method thereof. Background technique: [0002] With the development of electronic products in the direction of high density, miniaturization, and high reliability, rigid-flexible printed circuit boards are especially suitable for today's electronic products for light, Requirements for thin, short, and small features. [0003] The rigid-flex board is a combination of a soft board and a hard board. The thin-layered flexible bottom layer and the rigid bottom layer are combined, and then laminated into a single component to form a circuit board. It has both a rigid layer and a flexible layer. It is a multilayer printed circuit board. In the PCB industry, the rigid-flex board is a type of printed board that has grown very rapidly in recent years, with a fast growth rate and a wide range of applications. [0004] Such...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/14H05K3/36
Inventor 魏秀云邓先友朱方圆宋建远朱拓
Owner SHENZHEN SUNTAK MULTILAYER PCB
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