MEMS Jetting Structure For Dense Packing

Abstract

A fluid ejector includes a fluid ejection module having a substrate and a layer separate from the substrate. The substrate includes a plurality of fluid ejection elements arranged in a matrix, each fluid ejection element configured to cause a fluid to be ejected from a nozzle. The layer separate from the substrate includes a plurality of electrical connections, each electrical connection adjacent to a corresponding fluid ejection element.

Description

technical field [0001] The present disclosure generally relates to fluid ejection. Background technique [0002] Micro-electromechanical systems or micro-electromechanical systems (MEMS)-based devices can be used in a variety of applications, such as accelerometers, gyroscopes, pressure sensors or transducers, displays, optical switches, and fluid ejectors. Typically, one or more of the respective devices are formed on a single die, such as a die formed of an insulating material, a semiconducting material, or a combination of materials. The die can be processed using semiconductor processing techniques such as photolithography, deposition and etching. [0003] A fluid ejection device can have a plurality of MEMS devices each capable of ejecting fluid droplets from a nozzle onto a medium. In some devices that use mechanical actuators to eject fluid droplets, the nozzles are each fluidly connected to a flow path that includes a fluid pumping chamber. The fluid pumping chamb...

AI Technical Summary

Problems solved by technology

One obstacle to building smaller die is that the smaller packaging of the device reduces the area on the die available for electrical contacts

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