Coil-integrated switching power supply module

Abstract

A coil-integrated switching power supply module that provides an improved heat radiation effect to keep the temperature of the entire coil-integrated switching power supply module to a lower value includes a thermal diffusion conductor pattern arranged around a hole through which a magnetic core extends on a layer. The thermal diffusion conductor pattern continuously extends in areas where coil conductor patterns are located on other layers and outside areas where the coil conductor patterns are located on the other layers. In addition, the thermal diffusion conductor pattern includes slits at portions thereof and does not define a closed loop around the hole through which the magnetic core extends.

Description

technical field [0001] The present invention relates to a coil-integrated switching power supply module including a transformer having primary-secondary power transmission and voltage conversion functions. Background technique [0002] Patent Document 1, Patent Document 2, and Patent Document 3 disclose that wiring patterns of primary windings and secondary windings are formed on a plurality of substrates, through-holes are provided on a multilayer substrate on which the plurality of substrates are stacked, and from A chip transformer with a structure in which a ferrite core is inserted on both sides of the through hole, and an isolated switching power supply using the chip transformer. [0003] figure 1 , figure 2 shows that of Patent Document 3 image 3 , Figure 4 . figure 1 is an equivalent circuit diagram of an isolated DC-DC converter, figure 2 is description figure 1 A perspective view of the configuration of the installed state of the circuit. The magnetic ...

AI Technical Summary

Problems solved by technology

[0015] However, the coil-integrated switching power supply module is configured for one of the purposes of reducing the number of components and downsizing, and the size of the multilayer substrate is also minimized.

Therefore, along with the overall miniaturization, heat concentration tends to occur in the coil conductor pattern.

If the heat-resistant temperature of the material constituting the laminated substrate is exceeded due to the heat concentration of the coil conductor pattern, the laminated substrate will be discolored or deformed, and the reliability will be greatly impaired.

In addition, it will also have adverse effects on components installed near the coil conductor pattern

If there is no fan installed to cool the coil-integrated switching power supply module or the housing housing the module, or if the ambient temperature is high, the problem of heat dissipation becomes serious.

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