Coil-integrated switching power supply module

A switching power supply, all-in-one technology, applied in transformer/inductor coil/winding/connection, circuit, printed circuit, etc., can solve the problems of discoloration of laminated substrates, adverse effects of components, serious heat dissipation problems, etc.

Active Publication Date: 2012-05-23
MURATA MFG CO LTD
View PDF8 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] However, the coil-integrated switching power supply module is configured for one of the purposes of reducing the number of components and downsizing, and the size of the multilayer substrate is also minimized.
Therefore, along with the overall miniaturization, heat concentration tends to occur in the coil conductor pattern.
If the heat-resistant temperature of the material constituting the laminated substrate is exceeded due to the heat concentration of the coil conductor pattern, the laminated substrate will be discolored or deformed, and the reliability will be greatly impaired.
In addition, it will also have adverse effects on components installed near the coil conductor pattern
If there is no fan installed to cool the coil-integrated switching power supply module or the housing housing the module, or if the ambient temperature is high, the problem of heat dissipation becomes serious.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Coil-integrated switching power supply module
  • Coil-integrated switching power supply module
  • Coil-integrated switching power supply module

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach 》

[0043] refer to Figure 3 ~ Figure 13 The coil-integrated switching power supply module according to the first embodiment will be described.

[0044] image 3 This is an exploded sectional view of a coil-integrated switching power supply module. The laminated substrate included in the coil-integrated switching power supply module has five double-sided substrates B1, B2, B3, B4, and B5 in this example, and a prepreg is filled between adjacent double-sided substrates. In this way, since the multilayer substrate includes five double-sided substrates, the multilayer substrate has ten layers (layers S1 to S10 ).

[0045]Circuit element mounting electrodes (lands) are formed on the first layer S1 and the tenth layer S10 which are the outermost layers of the layers S1 to S10 , and the circuit element CE is mounted on the electrodes. In addition, internal via holes can be formed between the first layer and the second layer, and between the ninth layer and the tenth layer, so the pa...

no. 2 Embodiment approach 》

[0075] refer to Figure 14 , the coil-integrated switching power supply module according to the second embodiment will be described. Figure 14 It is a plan view of a conductor pattern formed on layer S6 of the laminated substrate included in the coil-integrated switching power supply module according to the second embodiment. This layer S6 corresponds to the Figure 9 Layer S6 is shown, but with a different conductor pattern. The conductor patterns of other layers are the same as the conductor patterns described in the first embodiment.

[0076] Such as Figure 14 As shown, on the layer S6, an extended coil conductor pattern E62 is formed around the hole H2. The expanded coil conductor pattern E62 extends continuously to the formation area of ​​the coil conductor pattern formed on the other plurality of layers and to the outside of the formation area of ​​the coil conductor pattern. In this example, the extended coil conductor pattern E62 extends to the periphery of the ...

no. 3 Embodiment approach 》

[0079] refer to Figure 15 The coil-integrated switching power supply module according to the third embodiment will be described. Figure 15 It is a cross-sectional view of an electronic device provided with the coil-integrated switching power supply module 100 according to the third embodiment. exist Figure 15Here, the laminated substrate LB is a laminated substrate of the coil-integrated switching power supply module described in the first embodiment. The coil-integrated switching power supply module 100 is constituted by the laminated substrate LB and the magnetic cores 106 and 107 .

[0080] Inside the laminated substrate LB, as shown in the first embodiment, the conductive pattern E60 for thermal diffusion is provided. Mounting electrodes of the thermal coupling component HC are formed on the upper surface of the laminated substrate LB, and the thermal coupling component HC is mounted on the mounting electrodes.

[0081] A conductor through hole PTH is formed between...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

A coil-integrated switching power supply module that provides an improved heat radiation effect to keep the temperature of the entire coil-integrated switching power supply module to a lower value includes a thermal diffusion conductor pattern arranged around a hole through which a magnetic core extends on a layer. The thermal diffusion conductor pattern continuously extends in areas where coil conductor patterns are located on other layers and outside areas where the coil conductor patterns are located on the other layers. In addition, the thermal diffusion conductor pattern includes slits at portions thereof and does not define a closed loop around the hole through which the magnetic core extends.

Description

technical field [0001] The present invention relates to a coil-integrated switching power supply module including a transformer having primary-secondary power transmission and voltage conversion functions. Background technique [0002] Patent Document 1, Patent Document 2, and Patent Document 3 disclose that wiring patterns of primary windings and secondary windings are formed on a plurality of substrates, through-holes are provided on a multilayer substrate on which the plurality of substrates are stacked, and from A chip transformer with a structure in which a ferrite core is inserted on both sides of the through hole, and an isolated switching power supply using the chip transformer. [0003] figure 1 , figure 2 shows that of Patent Document 3 image 3 , Figure 4 . figure 1 is an equivalent circuit diagram of an isolated DC-DC converter, figure 2 is description figure 1 A perspective view of the configuration of the installed state of the circuit. The magnetic ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H02M3/28H01F27/28H01F30/00H05K1/16
CPCH05K2201/0969H01F2027/2809H05K1/165H05K2201/086H01F27/22H02M3/28H05K2201/09063H05K1/0207H05K1/182H05K2201/093
Inventor 松本匡彦
Owner MURATA MFG CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap