Manufacture process of removing redundant metal filling of metal layer
A technology of redundant metal, manufacturing process, used in semiconductor/solid-state device manufacturing, electrical components, circuits, etc.
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[0040] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the manufacturing process for removing redundant metal filling in the metal layer according to the present invention will be described in detail below in conjunction with the accompanying drawings and preferred embodiments.
[0041] Different embodiments of the present invention will be described in detail below to implement different technical features of the present invention. It should be understood that the units and configurations of the specific embodiments described below are used to simplify the present invention, which are only examples and not limiting scope of the invention.
[0042] The present invention proposes a manufacturing process for removing redundant metal filling of metal layers, the process steps of which are as follows:
[0043] 1) Depositing a low-k dielectric layer;
[0044] 2) forming a hard mask layer on the ...
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