Pressure-sensitive acrylic acid thermally conductive adhesive, preparation method for same and application thereof

Abstract

The invention provides a pressure-sensitive acrylic acid thermally conductive adhesive, formed by dispersing a thermally conductive agent in monomer solution at first, then performing an in-situ polymerization, wherein the dosage ratio of the thermally conductive agent to the monomer is (1 to 4): (6 to 9); the thermally conductive agent is composed of 75-90% of carbon fibres and 10-25% of carbon nano-tubes; and the monomer is acrylic acid and / or acrylate. The pressure-sensitive acrylic acid thermally conductive adhesive provided by the invention is excellent in thermal conductivility and goodin environmental protection property because of uniformly dispersing a thermally conductive agent consisting of specific components in an acrylic acid polymerized monomer to form a stable three-dimensional meshy thermally conductive structure. The pressure-sensitive acrylic acid thermally conductive adhesive can be used between an LED (light-emitting diode) lamp bar and a back plate, between the LED lamp bar and an aluminium alloy section, between the back plate and the aluminium alloy section, between the gaps of chips such as CPU and GPU and a radiator, and in case that the gap of two contact surfaces is narrow in a liquid crystal module.

Description

technical field [0001] The invention relates to a thermally conductive pressure-sensitive adhesive, in particular to a pressure-sensitive acrylic thermally conductive adhesive, its preparation method and application. Background technique [0002] At present, with the development of microelectronics technology and assembly technology, modern electronic equipment is increasingly becoming a highly integrated system formed by high-density assembly and micro-assembly. relationship, the contact interface between the heating device and the heat sink in electronic products often cannot reach the theoretical "zero gap" contact, and the contact surface is as follows: figure 1 As shown, part of the interface between the heat generating device 12 (such as LED lights, chips, etc.) and the heat sink 13 (such as aluminum alloy profiles, back plates, etc.) is not in contact, and heat exchange can only be performed through the air layer A. [0003] The heat cannot be transmitted evenly thro...

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Problems solved by technology

[0005] For example, the thermally conductive adhesives disclosed in patent applications CN97181574.7, CN201010163571.9, CN91103592.3, CN200480010246.1, CN200780028241.5, and a high thermally conductive composite material disclosed in CN201110008919.1, which adopt the method of adding thermally conductive particles to In the polymer (solution) that has been polymerized, due to the small diameter of the heat-conducting particles and the high viscosity of the polymer, it is difficult to disperse evenly during the mixing process. When used, it will cause uneven heat distribution on the bonding surface and deteriorate the thermal conductivity. Thermal stress is likely to be generated during the thermal cycle shock, which will cause the performance of the film to deteriorate or even fail.

[0006] Patent application CN200510034477.2 discloses a thermal interface material, and CN200680045876.1 discloses a carbon nanotube composite, which is prepared by mixing a carbon nanotube-metal composite with silica gel. Nanomaterials with a high ratio are prone to the "cluster" phenomenon that often occurs in nanomaterials, and it is difficult to disperse into a uniform thermally conductive continuous phase in polymers

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