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Heating control device used for packaging equipment

A technology of heating control device and packaging equipment, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of uncontrollable temperature, unguaranteed temperature control accuracy, product scrapping, etc., and achieve the effect of ensuring stability

Active Publication Date: 2013-05-08
TONGLING FUSHI SANJIA MACHINE
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

The disadvantages of adopting the above method are: firstly, when an error occurs in the temperature control device, the PID algorithm will stop working, causing the temperature to be in an uncontrollable state, and thus the phenomenon of product scrapping is very likely to occur; secondly, the control accuracy of the temperature cannot be guaranteed; Third, when the line is disconnected, the alarm prompt cannot be given in time

Method used

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  • Heating control device used for packaging equipment
  • Heating control device used for packaging equipment

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Embodiment Construction

[0026] Such as figure 1 , 2 As shown, a heating control device for packaging equipment, the heating control device includes a temperature measuring component 10, the output end of the temperature measuring component 10 is connected to the input end of the temperature control module 20, and the output end of the temperature control module 20 is connected to the relay 30, and the power supply circuit at the control end of the relay 30 is provided with a heating element 40.

[0027] The input end of the temperature control module 20 is connected to the output end of the communication module 50 , and the input end of the communication module 50 is connected to the output end of the controller 60 .

[0028] Preferably, the temperature measuring component 10 is a thermocouple; the relay 30 is a solid state relay; and the controller 60 is a PLC controller.

[0029] Such as figure 2 As shown, further, a fuse 70 for short-circuit protection is connected in series in the power suppl...

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Abstract

The invention relates to a heating device in integrated circuit packaging equipment and especially relates to a heating control device used for packaging the equipment. The heating control device comprises a temperature measurement component. An output terminal of the temperature measurement component is connected with an input terminal of a temperature control module. The output terminal of the temperature control module is connected with a relay. A heating component is arranged in a power supply loop of a relay control terminal. In the heating device of the invention, the temperature control is separated from a processing scope of a system PLC controller so that the temperature control can not be interfered by factors, such as abnormity of the PLC controller. Therefore, stability and accuracy of the temperature can be guaranteed. Simultaneously, a short circuit protection function added in the invention is beneficial to protect hardware. And a broken line detection function contained in the invention can give alarm prompt in an initial failure stage so that the failure can be searched timely.

Description

technical field [0001] The invention relates to a heating device in integrated circuit packaging equipment, in particular to a heating control device for packaging equipment. Background technique [0002] Integrated circuit packaging equipment is high-precision and high-automation equipment. Its core part is the press used for packaging, and the accuracy of temperature control will directly affect the quality of packaging products. At present, the commonly used temperature control device mainly uses the temperature acquisition module to collect the current temperature, and uses the PID algorithm of its own temperature control to control the temperature. The disadvantages of adopting the above method are: firstly, when an error occurs in the temperature control device, the PID algorithm will stop working, causing the temperature to be in an uncontrollable state, and thus the phenomenon of product scrapping is very likely to occur; secondly, the control accuracy of the tempera...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/56
Inventor 汪辉周小飞
Owner TONGLING FUSHI SANJIA MACHINE
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