Epoxy resin composite material

Abstract

The invention provides an epoxy resin composite material, comprising epoxy resin and powder material, wherein the mass proportion of the epoxy resin to the powder material is 9: 1-6: 4; the coefficient of thermal expansion of the powder material is 0.1-3.5 PPM, and mean particle size D50 thereof is 0.1-10 microns. The epoxy resin composite material provided by the invention can obviously lower edge breakage rate, crack rate and gap rate during the production process of the silicon wafer, and obviously raise the yield of production of silicon wafer, and has excellent economic benefit and market prospect.

Description

technical field [0001] The invention relates to the chemical field, in particular to an epoxy resin composite material. Background technique [0002] With the decrease of fossil energy and the deterioration of the environment, photovoltaic power generation, as a clean and renewable energy, has gradually become the focus of attention and has been widely used in developed countries such as Europe and the United States. Among them, crystalline silicon photovoltaic has become the main photovoltaic power generation technology due to its low cost and mature technology. [0003] The crystalline silicon photovoltaic industry chain includes silicon raw materials-silicon wafers-cells-modules-systems. Among them, silicon wafer manufacturing includes crystal growth, multi-line mechanical cutting, degumming and cleaning, inspection and packaging. Since the silicon crystal needs to be bonded and fixed on the cutting table for cutting, its production process needs to be glued first and t...

AI Technical Summary

Problems solved by technology

In summary, the adjustment of the expansion coefficient of epoxy resin in the field of material packaging is relatively simple, but the adjustment of the expansion coefficient of epoxy resin in silicon wafer production is difficult, and many other factors need to be considered comprehensively, so we cannot simply learn from the field of material packaging Method of adjusting epoxy resin glue in medium

[0007] At present, in the field of silicon wafer production, there is no report on adding powder materials to epoxy resin glue to reduce defects such as chipping and chipping of silicon wafers.

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