Floor block

A technology of floor plates and bumps, which is applied in the directions of floors, buildings, building structures, etc., can solve the problem of no overlapping of floor plates, and achieve the effect of avoiding bulging, facilitating popularization and application, and having a simple structure.

Inactive Publication Date: 2012-04-04
王晶晶
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Aiming at the problem of no overlap between floorboards in the prior art, the present invention provides a floorboard that can better solve the above problems

Method used

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Embodiment Construction

[0011] Preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0012] This embodiment provides floor boards, refer to figure 1 The edge of the floorboard 1 is provided with a groove 2, and the thickness of the floorboard 4 at the outer end of the groove 2 is less than the thickness of the floorboard 5 at the inner end of the groove, so that the connection of adjacent floorboards can be realized conveniently; The protrusions 3 on the adjacent floor boards cooperate to realize the connection.

[0013] Preferably, the width of the groove 2 is slightly larger than the thickness of the adjacent floor block projection 3, which can provide necessary space for floor expansion.

[0014] This embodiment is only an exemplary description of this patent and does not limit its protection scope. Those skilled in the art can also make partial changes to it. As long as they do not exceed the spirit of this patent, they ...

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Abstract

The invention relates to a floor block and provides the floor block by aiming at the problem of no lap joint between the floor blocks in the prior art. The floor block has the innovation points that grooves are arranged at the edge of the floor block, the thickness of the floor block at the outer ends of the grooves is smaller than the thickness of the floor block at the inner ends of the grooves, and the grooves are matched with bulges arranged on the adjacent floor block for realizing the connection. The floor block in the structure does not have too high requirement on the skill of floor paving workers, the floor blocks can be paved only through the seam matching lap joint, in addition, after the floor block is paved onto the ground, when the floor block expands, the width of the grooves is greater than the thickness of the bulge blocks of the adjacent floor blocks, and the automatic contraction can be realized at the lap joint part, so the floor bulge is avoided. When the floor contraction occurs, the floor block receives the tension of the lap joint part during the contraction, so the attractive appearance influence on the ground caused by the excessive contraction of the floor block is avoided. The floor block has the advantages that the structure is simple, and greater cost does not need to be taken during the manufacture, so the floor block is favorable for popularization and application.

Description

Technical field: [0001] The invention relates to a floorboard. Background technique: [0002] When the current floor boards are laid on the ground, there is no overlap between them, but they are simply put together. The disadvantage of this is that it is difficult to grasp the size of the gap between the floor boards, so once the floor expands, it will Drums, or once the floor shrinks, large cracks will appear on the ground, which is not conducive to the beauty of the indoor environment and is not conducive to the maintenance of the floor. Invention content: [0003] Aiming at the problem of no overlap between the floor boards in the prior art, the present invention provides a floor board which can better solve the above problem. [0004] Said purpose is achieved by the following scheme: [0005] A floorboard, the innovation point is that the edge of the floorboard is provided with a groove, the thickness of the floorboard at the outer end of the groove is smaller than t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): E04F15/02
Inventor 王晶晶
Owner 王晶晶
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