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LED lamp with small surface opening rate

A technology of surface opening ratio and LED lamps, which is applied to the components of lighting devices, cooling/heating devices of lighting devices, lighting devices, etc. Problems such as high porosity, to achieve the effect that the area size can be adjusted arbitrarily, easy to install, and good flexibility

Inactive Publication Date: 2012-03-28
NANKER GUANGZHOU SEMICON MFG
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to further improve the heat dissipation effect, it is often made into an open structure, and the heat sink and other components of the radiator are exposed, resulting in the surface opening rate-the area of ​​the opening part on the projected area of ​​the annular surface and the projection of the annular surface Area ratio - very high, there is a potential safety hazard of touching or approaching the electrical components in the radiator from the surface, so the UL certification in the United States has restrictive requirements for the surface opening ratio of LED lamps, and the current exposed structure is difficult to meet the above Requirements for the surface opening ratio, and the high surface opening ratio results in poor waterproof and dustproof effects, which limits its application in outdoor and special environments

Method used

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  • LED lamp with small surface opening rate
  • LED lamp with small surface opening rate
  • LED lamp with small surface opening rate

Examples

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Embodiment Construction

[0020] Such as Figure 1 ~ Figure 4 As shown, the LED lamp with a small surface opening ratio in this embodiment is a high bay lamp, including a radiator 1, a cooling fan 2, a drive circuit board assembly 3, a power box upper cover 31, a power box lower cover 32, and a wind guide Cover 4, top cover 5, LED light source assembly 6, ventilation cover 100, connection and fixing assembly, light-transmitting protective cover 7, reflector 8, lampshade 9, the LED light source assembly 6 includes several LED chips and LED heat dissipation substrates, the The heat sink 1 includes a bottom plate 11, the bottom surface of the bottom plate 11 is a plane, the top surface of the bottom plate 11 is provided with a heat dissipation portion 12, and the heat dissipation portion 12 located at the periphery is in the shape of a sheet, arranged radially along the bottom plate 11 An air duct is formed, and the heat dissipation part 12 located in the center is needle-column to form criss-cross air ci...

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PUM

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Abstract

The invention discloses an LED lamp which can meet safety certificate and has the advantages of high safety and small surface opening rate. The LED lamp comprises a radiator (1), a driving circuit board component (3) and an LED light source component (6). Wherein the LED light source component (6) comprises a plurality of LED chips and LED heat-radiating basal plates, the LED lamp with small surface opening rate also comprises a ventilation hood (100), the exposure part of the radiator (1) is coated by the ventilation hood (100), a plurality of ventilation holes (101) are arranged on the ventilation hood (100), and the surface opening rate of the LED lamp is controlled by the opening rate of the ventilation hood (100). The LED lamp with small surface opening rate can be applied to field of the LED lamp.

Description

technical field [0001] The invention relates to an LED lamp, in particular to an LED lamp with a small surface opening ratio. Background technique [0002] LED has the advantages of high luminous efficiency, power saving and long life, and its application is more and more extensive. LEDs are used in daily lighting. In order to meet the illuminance requirements, it is generally necessary to concentrate power LEDs on one lamp. Therefore, the heat dissipation of LEDs has become an important factor affecting the use and life of LED lamps. Especially for high-power LED lamps, the problem of heat dissipation It has become a technical bottleneck affecting its wide application. At present, LED lamps generally use radiators for heat dissipation. In order to improve the heat dissipation effect, it is necessary to increase the heat dissipation area as much as possible, and the radiators are generally exposed, and the heat dissipation part of the radiator can be directly touched from t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S2/00F21V29/02F21V31/00F21Y101/02F21V29/67F21V29/83
Inventor 吴俊纬
Owner NANKER GUANGZHOU SEMICON MFG
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