The preparation method of multi-layer pcb board

Abstract

The invention relates to a method for preparing a multi-layer PCB (printed circuit board). The method comprises the following steps: providing a plurality of core boards according to the number of layers of the multi-layer PCB, wherein the initial copper thickness of the outward surfaces of the outward core boards is more than the target copper thickness; carrying out film stripping treatment on the plurality of core boards; carrying out oxidation treatment on the plurality of core boards subjected to film stripping treatment; using copper foils to carry out lamination treatment on the plurality of core boards subjected to oxidation treatment; and using etching solution to carry out micro-etching copper thinning treatment on the plurality of core boards subjected to lamination to ensure the copper thickness of the outward surfaces of the outward core boards to be equal to the target copper thickness. The formula of the etching solution comprises divalent copper ions (140-160g / l) and hydrogen chloride (3.65-10.95g / l); and the specific weight of the etching solution is 1200-1400g / l. The method has the following beneficial effects: by optimally adjusting the parameters of the micro-etching copper thinning process, the final copper reduction of the product can be very accurate, the inner layer is produced smoothly, the scrappage is reduced and the production cost is saved.

Description

technical field [0001] The present invention relates to a PCB (printed circuit board, printed circuit board) board, in particular to a preparation method of a multilayer PCB board. Background technique [0002] The current electronic products tend to be high-density and small-volume, so multi-layer PCB has a good market prospect. Most multi-layer PCB boards have yin and yang boards. The inner layer manufacturing process is complicated and the quality risks are relatively large. The conventional production process can easily lead to a high defect rate of the product, especially the copper thickness is difficult to be accurate, resulting in an increase in production costs. Contents of the invention [0003] Based on this, it is necessary to provide an improved multilayer PCB board and a manufacturing method thereof. [0004] A preparation method of a multilayer PCB board, comprising the steps of: providing a plurality of core boards according to the number of layers of the ...

AI Technical Summary

Problems solved by technology

Multi-layer PCB boards often have yin and yang boards. The inner layer manufacturing process is complicated and the quality risks are relatively large. The conventional production process can easily lead to a high defect rate of the product, especially the copper thickness is difficult to be accurate, resulting in an increase in production costs.

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