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Embedded package structure of LED light source

A technology of LED light source and packaging structure, applied in the direction of light source, electric light source, light source fixing, etc., can solve the problems of unstable current, many ghosts, and uncompact structure, so as to improve the heat dissipation efficiency, expand the heat dissipation area, and help processing effect

Inactive Publication Date: 2011-12-14
NINGBO YINZHOU LEIMAI SEMICON TECH
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  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although super-high-power LEDs can be made with this method, the method of making super-high-power LEDs is multiple pieces, the base is connected to the lamp, the structure is not compact, the heat conduction and heat dissipation structure is unreasonable, and the high heat cannot be dissipated when multiple connections emit light. It is difficult to control the current of the external switch constant current source, and the current is not stable. The biggest problem is that multiple brackets are connected to the lamps, and there are many ghost images.

Method used

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  • Embedded package structure of LED light source
  • Embedded package structure of LED light source
  • Embedded package structure of LED light source

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Embodiment Construction

[0020] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0021] see Figure 1-3 , an embedded packaging structure of an LED light source, comprising an LED light source, a bracket 2 and a base 3 . The LED light source is strip-shaped, including an optical lens 11 and an LED chip 12. The surface of the optical lens 11 is a sloped semicircle convex shape, and the inside is concave 13. The insulating bottom of the LED chip 12 is on the operating point required by the light source packaging process. Electrically and thermally conductive silver glue. The optical lens 11 is set above the LED chip 12. It adopts diffuse reflection and high light transmission optical glass. The lens body is extremely thin and has high light transmission performance. Different lenses can be selected according to different occasions, which solves the problem of difficult light distribution. , and the light source is designed...

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Abstract

The invention discloses an embedded packaging structure of an LED (light emitting diode) light source. The embedded packaging structure comprises a bracket, a base and an electrode, wherein the upper surface of the bracket is provided with a light source bowl cup. The embedded packaging structure is characterized in that an LED chip is connected with the electrode in series or in parallel and is arranged on the light source bowl cup, both the bottom of the bracket and the bottom of a base groove of the base matched with the bracket are flat-plate type, and the bracket is tightly adhered to the base. The embedded packaging structure has a simple and compact structure, is easy to manufacture and has the advantages of reasonable heat-dissipating structure and good heat-dissipating effect.

Description

technical field [0001] The invention relates to an embedded packaging structure of an LED light source. Background technique [0002] With the continuous innovation in the field of light-emitting diode (LED) technology, ultra-high-power LED products have been produced. However, the general products use large-area metal bases and use aluminum substrates as heat sinks to conduct heat generated by LED chips when they emit light. in the air. Encapsulation with a single large-size or multiple small-size chips can also effectively increase the power and brightness of the LED, but because the heat dissipation structure is not reasonable, it still cannot solve the problem of high heat when the chip is working, resulting in LED chips that are prone to light decay, Burned, and the process is difficult, the cost is high, and it is not easy to promote. [0003] An improved packaging structure has been developed, such as a high-power LED lamp bracket disclosed by the authorized announc...

Claims

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Application Information

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IPC IPC(8): F21S2/00F21V19/00F21V23/00F21V17/00F21V29/00F21Y101/02F21V29/74
Inventor 周大永王伟福程万潇
Owner NINGBO YINZHOU LEIMAI SEMICON TECH
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