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Vacuum pipette

A vacuum suction pen and vacuum suction nozzle technology, which is applied to workpiece clamping devices, manufacturing tools, etc., can solve problems such as inconvenience in use, and achieve the effects of saving production costs, avoiding chip breakage, and ensuring safety.

Active Publication Date: 2013-04-17
SEMICON MFG INT (SHANGHAI) CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The invention provides a vacuum suction pen to solve the problem that the existing vacuum suction pen must be connected with a vacuum system to provide vacuum, which is very inconvenient to use

Method used

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Embodiment Construction

[0021] The vacuum suction pen proposed by the present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments. Advantages and features of the present invention will be apparent from the following description and claims. It should be noted that the drawings are all in very simplified form and use imprecise ratios, which are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.

[0022] The core idea of ​​the present invention is to provide an easy-to-use vacuum suction pen that can firmly absorb wafers without relying on a vacuum system to provide vacuum.

[0023] Please refer to Figure 2A , which is a schematic diagram of a vacuum suction pen provided by an embodiment of the present invention. As shown in the figure, the vacuum suction pen 100 includes: a vacuum suction nozzle 110 and a piston-type vacuum device, and the piston-type vacuum device pass...

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Abstract

The invention provides a vacuum chuck. The vacuum chuck comprises a vacuum nozzle and a piston vacuumizing device; the piston vacuumizing device is connected with the vacuum nozzle through a check valve; and when air is exhausted through the vacuum nozzle by the piston vacuumizing device, the check valve prevents air from flowing back to the vacuum nozzle. The vacuum chuck can suck a wafer firmlywithout being externally connected with a vacuum system for vacuum supply, is convenient to use, can be applied to any occasion, and saves production cost.

Description

technical field [0001] The invention relates to the field of integrated circuit manufacturing, in particular to a vacuum suction pen. Background technique [0002] In the field of integrated circuit manufacturing, most of the processes can be automatically completed by machines, but there are still some processes that need to be carried out manually, such as the inspection process, which requires the operator to select from the cassette or wafer boat specific chips. In order to avoid the salt or oil that exists on the operator's skin from affecting the semiconductor device, the wafer is usually clamped with limited grasp tweezers, but it is also very easy to damage the wafer with this limited grasp tweezer. Edge, which in turn leads to failure of semiconductor devices and affects product yield. [0003] In order to solve this problem, the industry has introduced a vacuum suction pen (vacuum wand) to absorb the wafer, such as figure 1 As shown, the existing vacuum suction ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B25B11/00
Inventor 谢渊方明海吴静銮张士仁刘克斌
Owner SEMICON MFG INT (SHANGHAI) CORP
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