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Epoxy resin adhesive modified by unsaturated polyimide and preparation method thereof

A technology of polyimide resin and epoxy resin, which is applied in the directions of epoxy resin glue, novolac epoxy resin adhesive and adhesive, can solve the problem of high cost of polyetherimide resin and unfavorable large-scale promotion. Application, limited reactive groups, etc., to achieve the effect of excellent adhesion, high practical value, and low cost

Inactive Publication Date: 2011-09-14
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] (1) Reactive groups are limited, especially the content of unsaturated double bonds is low
[0009] (2) 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (BAHPFP) and other monomers are expensive, resulting in high cost of polyetherimide resin (HPEI) and adhesives, which is not conducive to Large-scale promotion and application can only be limited to some special fields

Method used

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  • Epoxy resin adhesive modified by unsaturated polyimide and preparation method thereof
  • Epoxy resin adhesive modified by unsaturated polyimide and preparation method thereof
  • Epoxy resin adhesive modified by unsaturated polyimide and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] The formula of modified epoxy resin adhesive of the present invention is as follows:

[0036]

[0037] Stir the above ingredients evenly at room temperature to obtain the unsaturated polyimide modified epoxy adhesive, which is designated as ES-MIE-1.

[0038] Take an appropriate amount of ES-MIE-1 adhesive, and evenly spread it on a standard iron sheet, stack it, clamp it, and put it into a blast oven for curing: start from room temperature and heat it up to 130°C, keep it warm for 1 hour, and continue to heat up to 150°C ℃, heat preservation reaction for 2 hours, continue to heat up to 175 ℃, heat preservation reaction for 3 hours, and naturally cool to room temperature.

[0039] The adhesive has good viscosity controllability, can be adjusted in a wide range, has good manufacturability, and has excellent bonding performance to iron sheets, and the tensile shear strength at room temperature (25°C) is as high as 17.3Mpa.

[0040] Take an appropriate amount of unsatu...

Embodiment 2

[0044] The formula of modified epoxy resin adhesive of the present invention is as follows:

[0045]

[0046] Stir the above ingredients evenly at room temperature to obtain the unsaturated polyimide modified epoxy adhesive, which is designated as ES-MIE-2.

[0047] Take an appropriate amount of ES-MIE-2 adhesive, and evenly spread it on a standard iron sheet, laminate, clamp, and put it into a blast oven for curing: start from room temperature to 130°C, keep warm for 1 hour, and continue to heat up to 150°C ℃, heat preservation reaction for 2 hours, continue to heat up to 175 ℃, heat preservation reaction for 3 hours, and naturally cool to room temperature.

[0048] The adhesive has good viscosity controllability, can be adjusted in a wide range, has good manufacturability, and has excellent bonding performance to iron sheets, and the tensile shear strength at room temperature (25°C) is as high as 16.8Mpa.

[0049] Take an appropriate amount of unsaturated polyimide modif...

Embodiment 3

[0053] The formula of modified epoxy resin adhesive of the present invention is as follows:

[0054]

[0055] Stir the above ingredients evenly at room temperature to obtain the unsaturated polyimide modified epoxy adhesive, which is designated as ES-MIE-3.

[0056] Take an appropriate amount of ES-MIE-3 adhesive, and evenly spread it on a standard iron sheet, laminate, clamp, and put it into a blast oven for curing: start from room temperature to 130°C, keep warm for 1 hour, and continue to heat up to 150°C ℃, heat preservation reaction for 2 hours, continue to heat up to 175 ℃, heat preservation reaction for 3 hours, and naturally cool to room temperature.

[0057] The adhesive has good viscosity controllability, can be adjusted in a wide range, has good manufacturability, and has excellent bonding performance to iron sheets, and the tensile shear strength at room temperature (25°C) is as high as 16.0Mpa.

[0058] Take an appropriate amount of unsaturated polyimide modif...

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Abstract

The invention relates to an epoxy resin adhesive modified by unsaturated polyimide and a preparation method thereof. A formula of the adhesive contains 80-85% of epoxy resin, 8-10% of unsaturated polyimide resin and 7-10% of curing agent in percentage by mass. By using the invention, the strength of the adhesive is effectively increased, the tensile shear strength at room temperature reaches up to 17.3 MPa and the brittleness of condensate is reduced; the epoxy resin adhesive provided by the invention is of very high practical value to the development of the adhesive industry, is favorable for realizing industrial production and has the advantages of simple preparation process and low cost. Broad application prospects are obtained in the fields of electronics, microelectronics, flexible copper clad laminates, flexible printed circuit boards, hard copper clad laminates, motors, aerospace and the like.

Description

technical field [0001] The invention belongs to the technical field of adhesives, in particular to an unsaturated polyimide modified epoxy resin adhesive and a preparation method thereof. Background technique [0002] Epoxy resin has many excellent properties: (1) Good bonding performance: high bonding strength and wide bonding surface, it is compatible with many metals (such as iron, steel, copper, aluminum, metal alloys, etc.) or non-metallic materials (such as glass, ceramics, wood, plastic, etc.) have very high bonding strength, and some even exceed the strength of the bonded material itself, so it can be used in many stressed structural parts and is one of the main components of structural adhesives (2) Good processing performance: the flexibility of epoxy resin formula, the diversity of processing technology and product performance are the most prominent among polymer materials; (3) Good stability performance: the curing of epoxy resin mainly depends on The ring-openi...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J163/04C09J179/08
Inventor 虞鑫海陈梅芳
Owner DONGHUA UNIV
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