Positioning device for electrode welding of semiconductor laser

Abstract

The invention relates to a positioning device for the electrode welding of a semiconductor laser, belonging to the technical field of semiconductor optoelectronics. The positioning device comprises a chassis (1), a base (2), a heat sink groove (3), a pulling plate (4), a handle (5), a pulling plate groove (6) and a spring (8), wherein the base (2) is fixed on the chassis (1) and provided with the heat sink groove (3) and the pulling plate groove (6); the heat sink groove (3) is communicated with the pulling plate groove (6); the pulling plate (4) is positioned in the pulling plate groove (6); the handle (5) is fixed on the pulling plate (4); and one end of the spring (8) is fixed on the base (2), and the other end of the spring (8) is fixed on the pulling plate (4). The invention has the advantages of simplifying the manual outer lead bonding technology, increasing the welding speed of an electrode lead of the high-power semiconductor laser, enhancing the finished product ratio of products and prolonging the service life of devices.

Description

technical field [0001] The invention belongs to the technical field of semiconductor optoelectronics, and relates to a positioning device for semiconductor laser electrode welding. Background technique [0002] At present, most domestic single-tube semiconductor laser electrodes are ordered from abroad. The purchased laser heat sink is a heat sink for solder and lead wires. It needs to be heated and burned to complete the chip, but the cost is very high. In China, the heat sink is generally placed in a through groove and the outer leads are welded with solder. During the welding process, it is very easy to have too much or too little solder, welding misalignment, etc., resulting in welding short circuit, virtual welding, etc. Phenomenon, it is easy to damage the chip, which seriously affects the stability, reliability, life and yield of high-power laser devices. Contents of the invention [0003] In order to solve the problems of shaking easily during welding due to small...

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Problems solved by technology

[0003] In order to solve the problems of shaking easily during welding due to small heat sinks and difficult welding of heat sink electrodes of different sizes, the purpose of the present invention is to provide a positioning device for semiconductor laser electrode welding, which effectively solves the problems caused by the existing packaging process. Soldering short circuit, virtual soldering, poor consistency of solder joints and other problems, thereby reducing costs and improving the packaging quality of devices

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