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Discarded circuit board full-value recycling method

A technology of discarded circuit boards and recycling methods, which is applied in the direction of electronic waste recycling, recycling technology, chemical instruments and methods, etc., can solve the problems of low recycling efficiency, environmental pollution, etc., achieve complete recycling, solve labor-intensive, and technological processes simple effect

Inactive Publication Date: 2011-09-07
广东省资源综合利用研究所
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome the defects of low recycling efficiency and serious environmental pollution in the prior art, and propose an efficient, economical and clean full-value recycling method for discarded circuit boards

Method used

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  • Discarded circuit board full-value recycling method
  • Discarded circuit board full-value recycling method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] Example 1: Computer main board 19.85kg, crushed as a whole by an intelligent crusher to a particle size of <20×20mm, and then secondary crushed to a particle size of <5.0mm by a high-speed hammer mill, and passed through a sieve size of 2.0mm oblique vibrating screening machine After sorting, 1.22kg of +2.0mm metal, 7.12kg of +2.0mm non-metal and 11.51kg of -2.0mm material were obtained. The -2.0mm material was gravity sorted on a conical shaker to obtain 4.19kg of -2.0mm metal material and 7.32kg of tailings. The -2.0mm metal material and +2.0mm metal 5.41kg were separated by wet magnetic separation with a field strength of 500Oe to obtain 1.61kg of magnetic metal and 3.8kg of non-magnetic metal. The main element content of non-magnetic metal was Cu: 45.78%, Ni: 0.45%, Sn: 8.11%, Au: 178.1g / t, Ag: 1656g / t, Pd: 93.0g / t. 14.44kg of tailings and +2.0mm non-metallic substances were deeply crushed to a particle size of <0.1mm by a vortex jet mill, and 2.85kg of inorganic s...

Embodiment 2

[0013] Example 2: 12.26 kg of microcomputer boards are crushed as a whole by an intelligent crusher to a particle size of <20×20mm, and then secondary crushed to a particle size of <5.0mm by a high-speed hammer mill, and vibrated obliquely through a sieve size of 2.0mm After sorting by the sieving machine, 0.67kg of +2.0mm metal, 4.93kg of +2.0mm non-metal and 6.66kg of -2.0mm material were obtained. The -2.0mm material was gravity-sorted on a tapered shaker to obtain 2.51kg of -2.0mm metal material and 4.15kg of tailings. The -2.0mm metal material and +2.0mm metal 3.18kg were separated by wet magnetic separation with a field strength of 800Oe to obtain 1.23kg of magnetic metal and 1.95kg of non-magnetic metal. The main element content of non-magnetic metal was Cu: 48.25%, Ni: 0.52%, Sn: 9.56%, Au: 194.2g / t, Ag: 1587g / t, Pd: 86.5g / t. 10.08kg of tailings and +2.0mm non-metals were deeply crushed to a particle size of <0.1mm by a vortex jet mill, and 7.25kg of organic matter an...

Embodiment 3

[0014] Example 3: 20.38 kg of electrical control circuit boards are crushed as a whole by an intelligent crusher to a particle size of <20×20mm, and then secondary crushed to a particle size of <5.0mm by a high-speed hammer mill. After sorting by the sieving machine, 2.15kg of +2.0mm metal, 7.65kg of +2.0mm non-metal and 10.58kg of -2.0mm material were obtained. The -2.0mm material was gravity-sorted on a tapered shaker to obtain 4.34kg of -2.0mm metal material and 6.24kg of tailings. The -2.0mm metal material and +2.0mm metal 6.49kg were separated by wet magnetic separation with a field strength of 1000Oe to obtain 2.32kg of magnetic metal and 4.17kg of non-magnetic metal. The main element content of non-magnetic metal was Cu: 48.23%, Ni: 0.51%, Sn: 7.42%, Au: 163.2g / t, Ag: 1754g / t, Pd: 84.2g / t. 13.89kg of tailings and +2.0mm non-metallic materials were deeply pulverized by a vortex jet mill to a particle size of <0.1mm. Under neutral medium conditions, 10.91kg of organic ma...

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Abstract

The invention relates to a discarded circuit board full-value recycling method. The method is characterized by comprising the following steps of: smashing a discarded circuit board, vibrating and sorting to obtain a material of minus 2.0mm, metal of plus 2.0mm and nonmetal of plus 2.0mm; sorting the material of minus 2.0mm by virtue of a table concentrator so as to obtain a metal material of minus 2.0mm and tailings; mixing the metal of plus 2.0mm and the metal material, and separating magnetic metal from nonmagnetic metal by wet magnetic separation; smashing the mixed nonmetal of plus 2.0mm and tailings until the particle size is less than 0.1mm, and under the condition of a neutral medium, carrying out flotation to separate organic matters and inorganic matters by adopting an octadecylamine collector; and sorting the inorganic matters by virtue of the table concentrator to obtain metal powder and nonmetal powder. The method provided by the invention is a high-efficiency, economic and clean discarded circuit board full-value recycling method and is applicable to recycling of electronic circuit boards of various electronic parts and components.

Description

technical field [0001] The invention relates to a method for recycling waste circuit boards, which realizes full-value clean recovery of waste circuit boards. Background technique [0002] Waste circuit boards are electronic circuit boards embedded with various electronic components. The significant difference from PCB boards is that they are complex in composition and have many types of materials. It is difficult to properly process and recycle them with simple processes. The types of organic materials contained in waste circuit boards include plastics, resin glass fiber materials, and resin-impregnated paper; metal materials mainly include steel materials, copper alloys, aluminum alloys, and other rare metal materials; non-metallic inorganic materials mainly include electronic ceramics, etc. At present, domestic treatment technologies include incineration-smelting method, dismantling-incineration-smelting method, dismantling-crushing and separation method, dismantling-acid...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B09B3/00B09B5/00B03B7/00
CPCY02W30/82
Inventor 刘勇徐晓萍何晓娟刘牡丹刘珍珍
Owner 广东省资源综合利用研究所
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