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Equitime constant reduced submodule plate simulating plurality of submodules of MMC (Multi-level Modular Converte)

A sub-module and equal-time technology is applied in the direction of output power conversion devices, electrical components, and conversion of AC power input to DC power output. Reliability and the effect of improving operation stability

Active Publication Date: 2011-08-10
CHINA ELECTRIC POWER RES INST +1
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  • Description
  • Claims
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Problems solved by technology

[0008] Even if the voltage level is reduced and the number of cascaded modules of a single bridge arm is increased, the discrete components of each sub-module are still connected by cables and fastening screws, and the components are placed on insulating plates or fixed in the cabinet. It is difficult to reduce the volume, and the loss of the connector is relatively large

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  • Equitime constant reduced submodule plate simulating plurality of submodules of MMC (Multi-level Modular Converte)
  • Equitime constant reduced submodule plate simulating plurality of submodules of MMC (Multi-level Modular Converte)
  • Equitime constant reduced submodule plate simulating plurality of submodules of MMC (Multi-level Modular Converte)

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Embodiment Construction

[0041] as attached figure 1 Shown is a schematic diagram of the connection of the sub-modules of the bridge arm of the traditional modular multi-level voltage source converter. The main circuit of the sub-module uses discrete components such as capacitors, resistors, and IGBT modules, which are installed on structural parts or insulating boards, and are generally connected by fastening screws or sockets. Weak current parts such as digital components and detection have sufficient insulation distance from the main circuit to prevent the controller from being interfered. When the voltage is high enough, the sub-module controller and the upper-level valve controller are generally isolated by optical fiber communication.

[0042] attached figure 2 It is a functional schematic diagram of the device of the present invention. On a sub-module board, a plurality of logically independent sub-modules are integrated, and the number of sub-modules can be adjusted according to the size of th...

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Abstract

The invention relates to a submodule circuit board for a dynamic analog test for simulating a high-capacity modularized multi-level modular converte. A plurality of independent MMC (Multi-level Modular Converte) submodules reducing parameters according to an equitime constant method with a voltage level less than 50V are arranged on the circuit board; the plurality of submodules are completely independent and are of a series relationship; and the submodule comprises chips for controlling, coding and decoding, an optical fiber channel, a main circuit (provided with a capacitor and two IGBTs (insulated gate bipolar transistor) of an upper-lower series structure connected with the capacitor in parallel, a bypass switch connected with the lower IGBT in parallel, and a thyristor used for protecting the IGBTs and the capacitor and connected with the lower IGBT in parallel), an IGBT and thyristor drive circuit, a capacitance voltage sampling circuit, and a circuit board isolating power source which are respectively independent.

Description

technical field [0001] The invention belongs to the field of power electronics, and relates to a low-voltage simulation test device for a modular multilevel (MMC) voltage source converter (VSC), in particular to a sub-equal time constant reduction sub-module for simulating multiple sub-modules of the MMC module board. Background technique [0002] There are currently two types of voltage source converters used in flexible DC transmission: one is a two-level or three-level converter based on high-power IGBT series technology, and the other is a module using high-voltage sub-module cascading technology Multilevel Voltage Source Converter (MMC-VSC). [0003] For the latter, its three-phase converter consists of six bridge arms, and each bridge arm is composed of multiple cascaded high-voltage sub-modules. Each high-voltage sub-module uses a power capacitor as a single DC voltage source (up to 1.2kV) that can be switched on or off, and two high-power IGBTs are connected in ser...

Claims

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Application Information

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IPC IPC(8): H02M7/217
CPCH02M1/32H02M2007/4835H02M7/4835
Inventor 赵岩刘栋王姗姗贺之渊滕乐天何维国刘隽张新刚
Owner CHINA ELECTRIC POWER RES INST
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