Film adhesion device for film active release

Abstract

The invention discloses a film adhesion device for film active release. The device is characterized by comprising a supporting shaft and a driving device, wherein the supporting shaft is used for supporting an adhesive film roll; and the driving device drives the supporting shaft to rotate. The film adhesion device for the film active release changes the conventional mode of pulling an adhesive film by a film clamping device to drive the adhesive film roll to rotate so as to release the adhesive film into a mode of driving the adhesive film roll by the driving device to rotate so as to release the adhesive film actively. When the adhesive film is pulled by the film clamping device to cover a wafer, a pulling force applied to the adhesive film by the film clamping device can be quite small, so that the adhesive film cannot be deformed by stretching, and the quality of film adhesion is improved.

Description

technical field [0001] The invention relates to a film sticking device for actively releasing films. Background technique [0002] After the wafer production is completed, packaging and testing are required. Wafer production and packaging testing are often carried out in different factories, therefore, need to be transported and transferred between different locations. In consideration of the safety of wafers during movement, the thickness of wafers manufactured by fabs is usually above 700um to prevent breakage during transportation. As the wafer size increases, its thickness gradually increases. [0003] But in many applications, the development trend of chips is getting thinner and thinner. Therefore, before packaging and testing, the wafer needs to be thinned. Usually, the circuit side of the wafer, that is, the side that completes the chip function, is called the front side, and the other side is the back side. The back side of the wafer is mainly composed of silic...

AI Technical Summary

Problems solved by technology

In this way, when sticking the film, the pulled out adhesive film 103 just needs to cover the edge of the wafer along the length direction, and there is no waste of the adhesive film along the length direction, but the waste is relatively large along the width direction.

The second situation is that if the width of the adhesive film 103 is smaller than the width of the base 101, then even if the clip 104 is opened, since the adhesive film 103 has been pasted on the wafer 102, the clip 104 returns to the position process before starting to stick the film. , or it will be blocked by the adhesive film attached to the wafer 102; or the two side edges in the width direction of the adhesive film 103 will be separated from the clip 104, even if the clip 104 returns to the position before the film is attached, it cannot be clamped smoothly. Film 103, will affect the next film application

Since the adhesive film has been adhered to the wafer at this time, and the wafer cannot be directly stretched or shrunk in the radial direction, the stress generated by the stretching of the adhesive film will cause the wafer to bend

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