Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Preparation method and use method of polishing solution for silicon carbide

A technology of polishing liquid and silicon carbide, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., and can solve problems such as low removal rate, unsuitability for industrial production, and long processing time

Inactive Publication Date: 2015-06-10
苏州天科合达蓝光半导体有限公司 +2
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional chemical mechanical polishing fluid generally uses silica polishing fluid directly. Its disadvantages are low removal rate and very long processing time. In actual production, it is always easy to cause a large number of scratches on the surface of the workpiece, which is not suitable for use with Industrial production

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Preparation method and use method of polishing solution for silicon carbide
  • Preparation method and use method of polishing solution for silicon carbide
  • Preparation method and use method of polishing solution for silicon carbide

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Step 1: Configure Polishing Fluid

[0019] (1) Mix reagent pure (or above) potassium hydroxide and potassium pyrophosphate in deionized water according to the mass ratio of the three as 5:1:200, and stir evenly to obtain a pH regulator;

[0020] (2) Mix hydrogen peroxide and deionized water at a ratio of 4:1 by volume, and stir evenly to obtain an auxiliary oxidizing agent. The stirring speed does not exceed 100 rpm.

[0021] (3) Mix the auxiliary oxidizing agent and the silicon dioxide polishing liquid according to the ratio of volume percentage of 1:2 and stir to obtain the intermediate evenly, and the stirring speed does not exceed 100 rpm.

[0022] (4) Mix the pH regulator into the intermediate, and adjust the pH to 9-10 (9.3) and the stirring speed does not exceed 100rpm

[0023] Step Two: Use

[0024] Adjust the temperature of the polishing disc to be controlled at a constant temperature of 10 degrees Celsius, and use a peristaltic pump to flow and supply the po...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
surface roughnessaaaaaaaaaa
Login to View More

Abstract

The invention provides polishing solution used on the surface of the high quality polished silicon carbide wafer, a preparation method of the polishing solution and a use method of the polishing solution. The polishing solution is prepared from deionized water, silica polishing solution, auxiliary oxidant and pH regulator. The polishing solution prepared by the method is odorless, has state and no precipitate and can be dispersed evenly and properly recycled; when the polishing solution is used to process the wafer, the removal rate is high; the processed silicon carbide wafer is brighter; the wafer has no unnoticeable scratches and is smooth and uniform when observed by a microscope with 50 fold magnification; and the surface roughness can reach nanometer level stably through the detection of an atomic force microscope. The cycle count of the polishing solution can be adjusted by changing the amounts of the added auxiliary oxidant and pH regulator or the ratio of the auxiliary oxidant and the pH regulator.

Description

technical field [0001] The invention relates to a polishing liquid for silicon carbide and a preparation method thereof. The polishing liquid can be used for chemical mechanical polishing, in particular to a polishing liquid for obtaining high-quality silicon carbide wafers and a preparation method thereof. Background technique [0002] Wide bandgap semiconductor materials represented by silicon carbide (SiC) and gallium nitride (GaN) are the third-generation semiconductors after silicon (Si) and gallium arsenide (GaAs). Compared with Si and GaAs traditional semiconductor materials, SiC has excellent properties such as high thermal conductivity, high breakdown field strength, high saturation electron drift rate and high bonding energy, and has great potential in high temperature, high frequency, high power and radiation resistant devices. Application prospect. In addition, silicon carbide, as a substrate material for epitaxial growth of other semiconductor thin films or cry...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/304
Inventor 张贺陈小龙黄青松王锡铭
Owner 苏州天科合达蓝光半导体有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com