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Method for preparing silver conductive adhesive by in situ synthesis

An in-situ synthesis and conductive adhesive technology, which is applied in the field of conductive adhesive, can solve the problems of complex post-treatment process, difficulty in large-scale production, and harsh conditions, and achieve the effects of low cost, simple preparation method, and uniform reaction conditions

Inactive Publication Date: 2013-09-18
CHANGZHOU HE RUN NEW MATERIAL TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] It has been reported that nano-scale silver particles, silver nanowires, silver-plated nanoparticles or nanofibers are used as conductive fillers to improve the conductivity of conductive adhesives or reduce the cost of conductive adhesives, such as Chinese patents CN1948814 and CN101215450, conductive adhesives are due to filling The conductive particles form a conductive network during the curing process of the resin, and have the ability to conduct electricity. The conductive adhesives currently used mainly add pre-prepared conductive fillers to the organic polymer matrix to make them have similar conductivity to metals. However, the above-mentioned In the process of preparing conductive adhesive, there are obvious shortcomings: the conditions for nano-preparation are relatively harsh, and the post-treatment process is relatively complicated, which makes it difficult to meet the requirements of large-scale production

Method used

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  • Method for preparing silver conductive adhesive by in situ synthesis
  • Method for preparing silver conductive adhesive by in situ synthesis

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] (1) Prepare a 1mol / L silver nitrate solution, disperse the silver nitrate in a mixed solution of 10ml of ethanol and 10ml of ethylene glycol, and make solution 1;

[0032] (2) Add epoxy resin (20% of the mass of silver nitrate solution) to solution 1, stir evenly, put it in a microwave oven, and irradiate it under microwave with a frequency of 2.45GHZ and a power of 320W for 2 minutes. Stand for one hour to remove the ethanol in the solution;

[0033] (3) Add 3% methyltetrahydrophthalic anhydride (curing agent) and 0.1% 2-ethyl-4-methylimidazole (curing accelerator) to the solution after standing, mix well, and the curing condition is 80 °C, 2h; 160°C, 4h, to obtain the conductive adhesive of the present invention.

Embodiment 2

[0035] (1) Prepare a 2mol / L silver nitrate solution, disperse the silver nitrate in a mixed solution of 5ml of ethanol and 25ml of glycerol to form solution 1;

[0036] (2) Add epoxy resin (25% of the mass of silver nitrate solution) to solution 1, stir evenly, put it in a microwave oven, and irradiate it for 3 minutes under a microwave with a frequency of 2.45GHZ and a power of 320W. Stand for one hour to remove the ethanol in the solution;

[0037] (3) Add 4% methylhexahydrophthalic anhydride (curing agent) and 0.3% 2-ethyl-4-methylimidazole (curing accelerator) to the solution after standing, mix well, and the curing condition is 80 °C, 2h; 160°C, 4h, to obtain the conductive adhesive of the present invention.

Embodiment 3

[0039] (1) Prepare a 4mol / L silver nitrate solution, disperse the silver nitrate in a mixed solution of 10ml of ethanol and 30ml of ethylene glycol, and make solution 1;

[0040] (2) Add epoxy resin (30% of the mass of silver nitrate solution) to solution 1, stir evenly, place in a microwave oven, irradiate for 4.5 minutes under a microwave with a frequency of 2.45GHZ and a power of 320W, at 80°C Stand for one hour to remove the ethanol in the solution;

[0041] (3) Add 5% methyltetrahydrophthalic anhydride (curing agent) and 0.5% 2,4,6-tris(dimethylaminomethyl)phenol (curing accelerator) to the solution after standing, and mix Uniform, curing conditions are 80°C, 2h; 160°C, 4h, to obtain the conductive adhesive of the present invention.

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Abstract

The invention relates to a conductive adhesive, in particular to a method for preparing a silver conductive adhesive by in situ synthesis. The method comprises the following steps of: dissolving silver nitrate in the mixed solution of ethanol and polyhydroxyl liquid organics; uniformly stirring to prepare a solution 1, wherein the concentration of mass amount of the silver nitrate is 1-4mol / L; adding epoxy resin into the solution 1 prepared in the step 1; uniformly stirring, and putting into a microwave oven to radiate for 2-4.5 minutes under microwave with the frequency of 2.45GHz and power between 320W and 480W to prepare a solution 2, wherein the addition amount of the epoxy resin is 20-30 percent of the weight of the solution 1; removing the ethanol in the solution 2, adding an anhydride curing agent and an anhydride curing accelerator into the solution 2; and uniformly stirring, and curing to prepare the conductive adhesive. The method solves the post-treatment problem in the nanometer preparation process, overcomes a series of defects, such as low yield and the like, has a uniform reacting condition compared with similar methods, and has a great progress compared with a two-step preparation method of a conductive adhesive.

Description

technical field [0001] The invention relates to conductive adhesives, in particular to a method for preparing silver conductive adhesives by in-situ synthesis. Background technique [0002] In recent years, as the main connecting material of electronic components, Sn-Pb solder has gradually emerged its shortcomings such as high soldering temperature, great environmental hazards, and inability to meet the working environment with small pitches. Conductive adhesives are used as Sn-Pb electronic packaging materials It is mainly used in liquid crystal displays, and gradually develops into the connection of integrated circuits (IC) of electronic products such as notebook computers and mobile phones. With the continuous development of its application range, conductive adhesives will surely become Sn-Pb Alternatives to solder. The conductive fillers of conductive adhesives in the prior art are mainly metal powders: Cu, Ni, Au, Ag or metal mixtures. Compared with Cu and Ni-based me...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/02C09J9/02B22F9/24
Inventor 吴海平陶宇李斌夏艳平陶新永
Owner CHANGZHOU HE RUN NEW MATERIAL TECH
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