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Heat treatment unit of gluing developing machine

A developing machine and gluing technology, which is used in photography, electrical components, opto-mechanical equipment, etc., can solve the problems of insufficient temperature monitoring, insensitive temperature control, uneven temperature, etc., saving time, low cost, and temperature monitoring. accurate effect

Active Publication Date: 2013-03-06
CSMC TECH FAB2 CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The heating plate, cooling plate and adhesive plate of the heat treatment unit in the ordinary glue developing machine generally only use a circular hot plate, and there is only one platinum resistance temperature sensor in the center of the hot plate, so the temperature monitoring If it is not in place, the temperature control is not sensitive, it is easy to cause uneven temperature, causing risky operation, and once the part is damaged, only the whole hot plate can be replaced, which is costly and troublesome to operate

Method used

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  • Heat treatment unit of gluing developing machine
  • Heat treatment unit of gluing developing machine

Examples

Experimental program
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Embodiment Construction

[0016] The heat plate structure and circuit system of the heat treatment unit of the glue developing machine will be described below mainly in conjunction with the accompanying drawings.

[0017] By dividing one hot plate of the heat treatment unit into multiple hot sub-plates, the wafers are heated separately, and each hot sub-plate has at least one temperature sensor for monitoring, which ensures that once there is a problem with the heat transfer of the hot sub-plate, the temperature will Uneven, the equipment automatically adjusts the temperature or alarms and stops working. Multiple heat sub-plates form a large circular heat plate area, which is monitored separately to ensure the accuracy of temperature processing and the stability of the alarm system, and only need to replace the damaged heat sub-plate instead of the entire heat sink. board, thereby reducing maintenance costs and improving maintenance efficiency.

[0018] The heat treatment unit heat plate can be an adh...

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Abstract

The invention relates to a heat treatment unit of a gluing developing machine. The heat treatment unit comprises more than two separate heating plates, wherein each separate heating plate is provided with at least one temperature sensor; and the more than two separate heating plates are combined into a round heating plate. A plurality of independent separate heating plates are respectively designed and mutually uninfluenced to form a large round heating plate, so that the temperature is more accurately controlled; each separate heating plate is provided with the at least one temperature sensor, so that the temperature is more accurately monitored, and an alarm can be timely given once a problem occurs; meanwhile, the heat treatment unit is easier to maintain, only the corresponding damaged separate heating plate is needed to be replaced and the whole large heating plate is not required to be replaced, so that cost is low, the heat treatment unit is easy to operate, and time is saved.

Description

【Technical field】 [0001] The invention relates to the field of semiconductor wafer manufacturing, in particular to a heat treatment unit of a glue-coating developing machine. 【Background technique】 [0002] Glue developer is widely used in semiconductor wafer processing, especially in the process of glue development, including adhesion promoter coating, photoresist, pre-baking, exposure, resist layer, post-baking and other processes. The heating plate, cooling plate and adhesive plate of the heat treatment unit in the ordinary glue developing machine generally only use a circular hot plate, and there is only one platinum resistance temperature sensor in the center of the hot plate, so the temperature monitoring If it is not in place, the temperature control is not sensitive, it is easy to cause uneven temperature, and cause risky operation, and once the part is damaged, only the whole hot plate can be replaced, which is costly and troublesome to operate. 【Content of invent...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/00H01L21/00G05D23/20G05D23/24
Inventor 张贤识王利赵军锋
Owner CSMC TECH FAB2 CO LTD
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