Laser cutting system for plates and cutting processing method thereof

Abstract

The invention discloses a laser cutting system for plates and a cutting processing method thereof, wherein the laser cutting system for plates comprises an installation seat, a laser focusing component and a high-speed lifting driving device, and the laser cutting processing method for plates comprises the following steps: (a) placing the plates to be cut on a processing platform, wherein the laser cutting system for plates is arranged in the position above the processing platform; and (b) generating relative motion between the processing platform and the laser cutting system for plates in the horizontal direction according to setting, wherein at the same time, the laser focusing component of the laser cutting system for plates makes high-speed up and down lifting circulating motion under the driving action of the high-speed lifting driving device, thereby cutting the plates. The laser cutting system for plates provided by the invention has the advantages of simple composition and low manufacturing cost, the cutting efficiency of the cutting processing method can be greatly enhanced, the processing speed is high, and the obtained cut product has the advantages of better edge effect, level cut notch and high yield.

Description

technical field [0001] The invention relates to a device used in a plate processing process and a method of using the same, in particular to a plate laser cutting system and a cutting method. Background technique [0002] Laser cutting system is a kind of equipment often used in sheet metal processing. The energy of this laser cutting system is very concentrated, and the deformation caused to the sheet during cutting is small or even no deformation. Sheets of complex shapes can be cut very accurately with a laser cutting system and require no further processing. However, the current laser cutting system is generally only suitable for processing the sheet with smaller thickness. For the sheet with larger thickness, the effect of the cutting product will be poor due to the influence of the depth of focus and other factors. [0003] Taking glass products as an example, since the influence of the focal depth of the glass is particularly sensitive, in order to obtain better qua...

AI Technical Summary

Problems solved by technology

This method of layered cutting is very inefficient, time-consuming and labor-intensive, and due to the high requirements for the coincidence of motion trajectories, the precision requirements for position control components are high, and the production cost is relatively high.

If the control is inaccurate, errors will easily occur and affect the cutting effect

[0004] To sum up, there is currently no laser cutting system suitable for cutting thicker plates, nor is there a suitable laser cutting method to make the cutting of thicker plates more efficient and convenient

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