Contact thermal resistance test method of GH4169/K417 alloy with additional heating

Abstract

The invention discloses a contact thermal resistance test method of a GH4169 / K417 alloy with additional heating. The method comprises the following steps of: firstly, confirming the reduced elasticity modulus of two contact materials and then modeling according to a plastic deformation principle of a metal material; simplifying the model; finally, confirming unknown parameters through a stepwise regression test to acquire an optimal regression equation; and acquiring the contact thermal conduction of the GH4169 / K417 alloy according to a regression analysis result and taking the reciprocal of the contact thermal conduction to acquire contact thermal resistance. When the temperature is in an interval of 100-600 DEG C, and temperature and pressure values are selected as independent variables, hs=160.4528T0.012P1.005; and when only the pressure value is selected as the independent variable, hs=168.85P1.007. If the needed parameters are acquired only through test data, the contact thermal conduction can be acquired according to a simple formula under the conditions of randomly changing test temperature and pressure so as to simplify and repeatedly use the test process of the contact thermal resistance. The method provided by the invention greatly simplifies the test process of the contact thermal conduction on the premise of ensuring the engineering practicability and the test result accuracy.

Description

technical field [0001] The invention relates to the technical field of material testing, in particular to a method for testing thermal contact resistance of a GH4169 / K417 alloy with compensation heating. Background technique [0002] Many models, empirical and semi-empirical relations for predicting contact conductance have been proposed in the past few decades. The classic models include the Mikic elastic model, the CMY (Cooper, Mikic and Yovanovich) plastic model, and the elastic-plastic deformation model by Sridar and Yovanovich. The theoretical research in China is mainly reflected in the numerical simulation of contact thermal resistance. [0003] In the prior art, the contact thermal resistance test of two high-temperature materials is carried out through a large number of tests. The test process is to select the interface material and process it into a sample with a certain size and a certain interface roughness, and then pressurize and heat the interface. Provide a...

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Problems solved by technology

[0004] Although the existing test technology can accurately obtain the contact heat conduction under the conditions of given temperature, pressure and interface roughness, due to the complexity of the test process and relatively fixed test conditions, it cannot meet the changing temperature and pressure conditions in engineering applications. Unable to provide timely and accurate contact thermal conductivity data at the material interface

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