Large-power electronic product cooling device

Abstract

The invention relates to a large-power electronic product cooling device which is composed of a graphite cooling fin and a metal superconducting pedestal and is characterized in that the metal superconducting pedestal is provided with a groove for installing the graphite cooling fin, the groove of the metal superconducting pedestal is matched with the graphite cooling fin, the surface of the graphite cooling fin is in texture state, and the structure can ensure cool on larger area. The graphite cooling fin is stuck to the metal superconducting pedestal by heat conduction epoxy resin so as to keep the lightness of the cooling device and improve cooling effect; a plurality of transparent cavities are arranged in the metal superconducting pedestal, which is favourable for convection between heat on the metal superconducting pedestal and outside air and greatly lowers the weight of the metal superconducting pedestal. Thus, the cooling device has simple structure, light weight and good cooling effect, is easy to operate and can be widely applied in the cooling system of the electronic device.

Description

technical field [0001] The invention relates to a heat dissipation device for high-power electronic products, which is mainly used for heat dissipation of high-power electronic products and belongs to the application field of heat dissipation of high-power electronic products. Background technique [0002] High-power electronic products will generate a lot of heat during use. In order to ensure the normal operation of high-power electronic products and prolong their service life, it is generally necessary to use a heat sink to dissipate heat from high-power electronic products. At present, the heat dissipation devices used for high-power LED light sources mainly include the following types: (1) Use a metal heat dissipation plate, and fix the high-power electronic products on it, and then the heat emitted by the high-power electronic products will be dissipated through the metal heat dissipation plate Cooling, this method is currently more commonly used; (2) Use a metal heat ...

AI Technical Summary

Problems solved by technology

[0003] According to the heat dissipation methods of the above several heat dissipation devices, it can be known that these heat dissipation devices have played a certain role in the heat dissipation and cooling of high-power LED light sources, but because of the small heat dissipation area, the heat dissipation effect is limited, and the heat dissipation and cooling effect is poor, which affects the high-power electronics. Product life and work efficiency

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